Abstract: This disclosure involves a substrate, an electrode chip including a base material and a diamond thin film, and an insulating resin configured to seal at least part of a surface of a conductive member included in the electrode chip. The insulating resin is provided so as to expose at least part of the diamond thin film. When an exposed surface of the diamond thin film is measured by time-of-flight secondary ion mass spectrometry, an integrated value BL per unit area of ionic strength of organic matter with a molecular weight of 100 or more is 1.2×106 cts/sec or less.

Abstract: There is provided an electrochemical sensor, comprising: a working electrode; a counter electrode; and a base material supporting the working electrode and the counter electrode, wherein the working electrode is a chip-shaped electrode including a diamond film that causes a redox reaction on its surface when a predetermined voltage is applied in a state where a test sample exists between the working electrode and the counter electrode, and a support that comprises a material other than diamond and supports the diamond film, and the working electrode is mounted on the base material, with the support positioned on the base material side and at least a part of a side surface of the support exposed.

Abstract: An electrochemical sensor unit including: a working electrode; and a counter electrode, wherein the working electrode includes a diamond film which generates a redox reaction on a surface when a voltage is applied between the working electrode and the counter electrode, and a support which is formed of a material different from diamond and supports the diamond film, when the working electrode is viewed laterally, in the support, a width of a surface opposite to a surface in contact with the diamond film is smaller than a width of the diamond film, and a liquid test sample is supplied to the working electrode from the diamond film side.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A nitride semiconductor epitaxial wafer includes a growth substrate including a surface for growing a nitride semiconductor thereon, a first structure layer formed on the growth substrate, a dislocation propagation direction changing layer formed on the first structure layer for changing a propagation direction of a dislocation propagated in the first structure layer into a lateral direction, a second structure layer formed on the dislocation propagation direction changing layer, and a buffer layer formed on the second structure layer for changing a propagation direction of a dislocation propagated in the second structure layer.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AlN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.

Abstract: A nitride semiconductor epitaxial wafer includes a growth substrate including a surface for growing a nitride semiconductor thereon, a first structure layer formed on the growth substrate, a dislocation propagation direction changing layer formed on the first structure layer for changing a propagation direction of a dislocation propagated in the first structure layer into a lateral direction, a second structure layer formed on the dislocation propagation direction changing layer, and a buffer layer formed on the second structure layer for changing a propagation direction of a dislocation propagated in the second structure layer.

Abstract: A semiconductor integrated circuit device having a plurality of semiconductor electronic members including a field effect transistor, intended for suppressing a sidegating effect on the field effect transistor, wherein accumulation of majority carriers of the field effect transistor is suppressed at the interface of heterojunction in the buffering compound semiconductor layer and the interface between the substrate and the buffering compound semiconductor layer in the device isolation region so that the discontinuity of energy forbidden bands of the semiconductors caused at the interfaces does not form a potential barrier upon conduction of the carriers into the substrate, whereby the sidegating effect from the resistor element, etc. placed adjacently to the field effect transistor can be decreased drastically.

Abstract: A semiconductor epitaxial substrate includes: a single crystal substrate; an AlN layer epitaxially grown on the single crystal substrate; and a nitride semiconductor layer epitaxially grown on the AN layer, wherein an interface between the AlN layer and nitride semiconductor layer has a larger roughness than an interface between the single crystal substrate and AlN layer, and a skewness of the upper surface of the AlN layer is positive.