Abstract: A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.

Abstract: A resistor contains a resistance body and a pair of electrodes (a first electrode body and a second electrode body), wherein end surfaces of the resistance body are respectively abutted to and bonded to end surfaces of the electrodes (a first electrode body and a second electrode body), the electrodes (a first electrode body and a second electrode body) each includes a main body portion and a leg portion, the leg portion protruding from the main body portion in the mounting surface of the resister, and a length dimension of the resistor is equal to or shorter than 3.2 mm.

Abstract: A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.