Abstract: A method of manufacturing a substrate with chips includes the following (A) and (B): (A) preparing a stacked substrate, the stacked substrate including: a plurality of chips; a first substrate to which the plurality of chips are temporarily bonded; and a second substrate bonded to the first substrate via the plurality of chips; and (B) separating the plurality of chips bonded to the first substrate and the second substrate, from the first substrate, in order to bond the plurality of chips to one surface of a third substrate including a device layer. In this method, the first substrate, from which the plurality of chips are separated, includes alignment marks that are used to ensure alignment when the first substrate and the plurality of chips are bonded together, or that are used to measure misalignment after the first substrate and the plurality of chips are bonded together.

Abstract: An information processing device allocates each portion of a table used in query processing with respect to a database managed by the information processing device, as a portion under responsibility of each of a plurality of other information processing devices, and instructs the plurality of other information processing devices to perform processing with respect to the portion under responsibility by referring to another synchronized database managed by each of the plurality of other information processing devices.

Abstract: An ultrasonic oscillator retains transducers on a deformable concave portion, the transducers move in conformity with deforming of the concave portion, and the controller comprises receiver that receives sensing signals output from the sensing side transducers which sensed the ultrasonic waves oscillated from the oscillation side transducers, a distance calculation unit that calculates the distance between the oscillation side transducer and the sensing side transducer based on propagation time of the direct wave, an angle calculation unit that calculates a visual angle between a center axis of oscillation and the sensing side transducer viewed from the oscillation side transducer based on the sensing signal related to the direct wave, and a correction unit that corrects position information indicating a relative positional relationship between the plurality of transducers by using the distance and the visual angle.

Abstract: An information processing device allocates each portion of a table used in query processing with respect to a database managed by the information processing device, as a portion under responsibility of each of a plurality of other information processing devices, and instructs the plurality of other information processing devices to perform processing with respect to the portion under responsibility by referring to another synchronized database managed by each of the plurality of other information processing devices.