Patents by Inventor Yohei Yagishita

Yohei Yagishita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SHEET-SHAPED STRUCTURE, METHOD FOR MANUFACTURING SHEET-SHAPED STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20120236502
    Abstract: According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.
    Type: Application
    Filed: February 23, 2012
    Publication date: September 20, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Masaaki Norimatsu, Shinichi Hirose, Yohei Yagishita, Yukie Sakita
  • HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20120218713
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Application
    Filed: May 7, 2012
    Publication date: August 30, 2012
    Applicant: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20120218715
    Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
    Type: Application
    Filed: November 30, 2011
    Publication date: August 30, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Shinichi HIROSE, Taisuke Iwai, Yoshitaka Yamaguchi, Yohei Yagishita, Yukie Sakita, Masaaki Norimatsu
  • Heat radiation material, electronic device and method of manufacturing electronic device
    Patent number: 8194407
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: June 5, 2012
    Assignee: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20100124025
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 20, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita