Patents by Inventor Yohei YOSHIMURA
Yohei YOSHIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964416Abstract: A resin part includes a molded main body that has a plate shape with a longitudinal direction and is constituted of an injection-molded product. The resin part has a gate portion that is a vestige of a resin injection gate. The gate portion is located in an end face part of the molded main body to cross a position corresponding to a center of gravity of the molded main body; the end face part extends in the longitudinal direction of the molded main body.Type: GrantFiled: June 25, 2021Date of Patent: April 23, 2024Assignee: DENSO CORPORATIONInventors: Yohei Yoshimura, Takeshi Kusano, Kentaro Fukuda, Mitsuhiro Suzuki
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Patent number: 11801626Abstract: A resin part includes a plate-shaped molded main body that is constituted of an injection-molded product. Of plate surfaces of the molded main body, a surface on an opposite side to a surface requiring surface accuracy constitutes a pressure-application surface to which pressure is applied by a movable insert. A parting line is formed on the pressure-application surface by the movable insert to satisfy the following relationship: (t/4)?x?(3t/2), where x is a distance from an end edge part of the molded main body to the parting line and t is a thickness of the molded main body.Type: GrantFiled: June 25, 2021Date of Patent: October 31, 2023Assignee: DENSO CORPORATIONInventors: Yohei Yoshimura, Takeshi Kusano, Kentaro Fukuda, Mitsuhiro Suzuki
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Patent number: 11685087Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the accommodation step, the two individual conductive members are sandwiched in the facing orientation thereof by outer support members abutting outer surfaces of the conductive members, and inner support members abutting inner surfaces of the conductive members. Outer recesses are formed in the outer surfaces by the outer support members, and inner recesses are formed in the inner surfaces by the inner support members. The outer recesses are deeper in the Z direction than the inner recesses.Type: GrantFiled: May 4, 2020Date of Patent: June 27, 2023Assignee: DENSO CORPORATIONInventors: Akifumi Kurita, Yohei Yoshimura, Ryota Tanabe
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Patent number: 11660793Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.Type: GrantFiled: February 4, 2022Date of Patent: May 30, 2023Assignee: DENSO CORPORATIONInventors: Akifumi Kurita, Yohei Yoshimura, Ryota Tanabe
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Patent number: 11623376Abstract: Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.Type: GrantFiled: May 4, 2020Date of Patent: April 11, 2023Assignee: DENSO CORPORATIONInventors: Akifumi Kurita, Yohei Yoshimura, Ryota Tanabe, Tsuyoshi Arai
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Patent number: 11524434Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.Type: GrantFiled: May 4, 2020Date of Patent: December 13, 2022Assignee: DENSO CORPORATIONInventors: Akifumi Kurita, Yohei Yoshimura, Ryota Tanabe
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Publication number: 20220152895Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.Type: ApplicationFiled: February 4, 2022Publication date: May 19, 2022Inventors: Akifumi KURITA, Yohei YOSHIMURA, Ryota TANABE
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Publication number: 20210316487Abstract: A resin part includes a molded main body that has a plate shape with a longitudinal direction and is constituted of an injection-molded product. The resin part has a gate portion that is a vestige of a resin injection gate. The gate portion is located in an end face part of the molded main body to cross a position corresponding to a center of gravity of the molded main body; the end face part extends in the longitudinal direction of the molded main body.Type: ApplicationFiled: June 25, 2021Publication date: October 14, 2021Inventors: Yohei YOSHIMURA, Takeshi KUSANO, Kentaro FUKUDA, Mitsuhiro SUZUKI
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Publication number: 20210316488Abstract: A resin part includes a plate-shaped molded main body that is constituted of an injection-molded product. Of plate surfaces of the molded main body, a surface on an opposite side to a surface requiring surface accuracy constitutes a pressure-application surface to which pressure is applied by a movable insert. A parting line is formed on the pressure-application surface by the movable insert to satisfy the following relationship: (t/4)?x?(3t/2), where x is a distance from an end edge part of the molded main body to the parting line and t is a thickness of the molded main body.Type: ApplicationFiled: June 25, 2021Publication date: October 14, 2021Inventors: Yohei YOSHIMURA, Takeshi KUSANO, Kentaro FUKUDA, Mitsuhiro SUZUKI
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Publication number: 20200262114Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the accommodation step, the two individual conductive members are sandwiched in the facing orientation thereof by outer support members abutting outer surfaces of the conductive members, and inner support members abutting inner surfaces of the conductive members. Outer recesses are formed in the outer surfaces by the outer support members, and inner recesses are formed in the inner surfaces by the inner support members. The outer recesses are deeper in the Z direction than the inner recesses.Type: ApplicationFiled: May 4, 2020Publication date: August 20, 2020Inventors: Akifumi KURITA, Yohei YOSHIMURA, Ryota TANABE
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Publication number: 20200262115Abstract: Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.Type: ApplicationFiled: May 4, 2020Publication date: August 20, 2020Inventors: Akifumi KURITA, Yohei YOSHIMURA, Ryota TANABE, Tsuyoshi ARAI
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Publication number: 20200262119Abstract: A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.Type: ApplicationFiled: May 4, 2020Publication date: August 20, 2020Inventors: Akifumi KURITA, Yohei YOSHIMURA, Ryota TANABE
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Patent number: 10522957Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.Type: GrantFiled: July 19, 2018Date of Patent: December 31, 2019Assignee: DENSO CORPORATIONInventors: Ryota Tanabe, Akihumi Kurita, Yohei Yoshimura
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Publication number: 20190036282Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.Type: ApplicationFiled: July 19, 2018Publication date: January 31, 2019Applicant: DENSO CORPORATIONInventors: Ryota TANABE, Akihumi KURITA, Yohei YOSHIMURA