Abstract: An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.

Abstract: An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.

Abstract: A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.

Abstract: An electronic system includes an electronic system cabinet housing at least one electronic system component and a power generation system. The power generation system includes a cooling system having a cooling medium that generates a cooling energy. The power generation system further includes a thermoelectric conversion element having a first side and a second side. The first side is in a heat exchange relationship with the at least one electronic system component and the second side is in a heat exchange relationship with the cooling medium. Heat energy generated by the at least one electronic system component raises a temperature of the first side and the cooling energy generated by the cooling medium lowers a temperature of the second side to establish a temperature difference. The thermoelectric conversion element produces an electro-motive force based on the temperature difference.

Abstract: A cooling system that promotes cooling of a device including a heat source therein is provided, the cooling system includes: a cooling unit that absorbs, upstream from the heat source, heat from intake air that the device takes in from an outside to cool the heat source and dissipates the heat to an outside of a flow path of the intake air; and a fluid control unit that lets fluid flow toward the cooling unit so as to discharge the heat absorbed by the cooling unit from the intake air to an outside of the cooling unit.

Abstract: A program for a setting device for setting a memory control device which, in part, acquires memory attribute information indicating an attribute of the memory module, a data transfer rate setting value as a rate of an upper limit value of a data transfer rate relative to a maximum data transfer rate, an upper limit value of the data transfer rate being at which the memory control device accesses the memory module, and the maximum data transfer rate being at which the memory control device is able to access the memory module. The setting device can appropriately control the heating value and the upper limit temperature for each of the plurality of memory modules mutually different in type though mutually compatible.

Abstract: A program for a setting device for setting a memory control device which, in part, acquires memory attribute information indicating an attribute of the memory module, a data transfer rate setting value as a rate of an upper limit value of a data transfer rate relative to a maximum data transfer rate, an upper limit value of the data transfer rate being at which the memory control device accesses the memory module, and the maximum data transfer rate being at which the memory control device is able to access the memory module. The setting device can appropriately control the heating value and the upper limit temperature for each of the plurality of memory modules mutually different in type though mutually compatible.

Abstract: A setting device for setting a memory control device which, in part, acquires memory attribute information indicating an attribute of the memory module, a data transfer rate setting value as a rate of an upper limit value of a data transfer rate relative to a maximum data transfer rate, an upper limit value of the data transfer rate being at which the memory control device accesses the memory module, and the maximum data transfer rate being at which the memory control device is able to access the memory module. The setting device can appropriately control the heating value and the upper limit temperature for each of the plurality of memory modules mutually different in type though mutually compatible.

Abstract: A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.

Abstract: A CPU cooler is provided for effectively cooling, for example, a CPU chip mounted in a notebook-sized personal computer. An aluminum die casting is equipped with a right portion for covering a CPU package, and a left portion which is coplanar with the right portion and continuous to the right portion, thus forming a fan disposing space. A flat heat pipe is mounted on a bottom surface of the right and left portions and extends linearly. A copper plate is equipped with a first horizontal plate portion for covering the bottom surface of the right portion and the flat heat pipe, and a second horizontal plate portion which faces a second top surface in a height direction and defines the bottom side of a fan disposing space.

Abstract: A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.

Abstract: A CPU cooler is provided for effectively cooling, for example, a CPU chip mounted in a notebook-sized personal computer. An aluminum die casting is equipped with a right portion for covering a CPU package, and a left portion which is coplanar with the right portion and continuous to the right portion, thus forming a fan disposing space. A flat heat pipe is mounted on a bottom surface of the right and left portions and extends linearly. A copper plate is equipped with a first horizontal plate portion for covering the bottom surface of the right portion and the flat heat pipe, and a second horizontal plate portion which faces a second top surface in a height direction and defines the bottom side of a fan disposing space.