Patents by Inventor Yohichi Ohmura

Yohichi Ohmura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device housing
    Patent number: 7939796
    Abstract: An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: May 10, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toshikazu Satone, Mikio Iijima, Hajime Nakajima, Takashi Okamuro, Yohichi Ohmura
  • ELECTRONIC DEVICE HOUSING
    Publication number: 20100148044
    Abstract: An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.
    Type: Application
    Filed: March 29, 2007
    Publication date: June 17, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Toshikazu Satone, Mikio Iijima, Hajime Nakajima, Takashi Okamuro, Yohichi Ohmura