Abstract: A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film.

Abstract: An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.

Abstract: An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.

Abstract: A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film.

Abstract: The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.

Abstract: There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-V?W?nY??(1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).