Patents by Inventor Yohsuke Ishikawa
Yohsuke Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11638349Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.Type: GrantFiled: June 19, 2020Date of Patent: April 25, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Dai Sasaki, Yasunori Nishiguchi, Kazuki Matsumura, Yohsuke Ishikawa, Hiroki Tamiya, Koji Kishino
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Publication number: 20220353988Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.Type: ApplicationFiled: June 19, 2020Publication date: November 3, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Dai SASAKI, Yasunori NISHIGUCHI, Kazuki MATSUMURA, Yohsuke ISHIKAWA, Hiroki TAMIYA, Koji KISHINO
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Patent number: 11452216Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.Type: GrantFiled: July 25, 2018Date of Patent: September 20, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki Matsumura, Yohsuke Ishikawa, Koji Kishino
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Publication number: 20220259378Abstract: A resin composition contains: a modified polyphenylene ether compound (A) having, at one terminal, a group with an unsaturated double bond; a cross-linking agent (B) having a carbon-carbon double bond; a hindered amine-based polymerization inhibitor (C); and a solvent (D).Type: ApplicationFiled: June 19, 2020Publication date: August 18, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Dai SASAKI, Yohsuke ISHIKAWA, Kazuki MATSUMURA, Yasunori NISHIGUCHI, Hiroki TAMIYA, Koji KISHINO
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Publication number: 20210161020Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.Type: ApplicationFiled: July 25, 2018Publication date: May 27, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki MATSUMURA, Yohsuke ISHIKAWA, Koji KISHINO
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Patent number: 10751976Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.Type: GrantFiled: January 24, 2017Date of Patent: August 25, 2020Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Yohsuke Ishikawa, Yoshiaki Esaki, Takayoshi Ozeki, Jun Tochihira, Ryu Harada
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Publication number: 20200157300Abstract: The resin composition includes: an epoxy resin as Component (A); a phenolic compound as Component (B); and an imidazole compound having a triazine skeleton, as Component (C). A cured product of the resin composition has a glass transition temperature of 260° C. or more.Type: ApplicationFiled: June 4, 2018Publication date: May 21, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yohsuke ISHIKAWA, Kazuki MATSUMURA, Koji KISHINO
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Publication number: 20190061320Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.Type: ApplicationFiled: January 24, 2017Publication date: February 28, 2019Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD., TOMOEGAWA CO., LTD.Inventors: Yohsuke ISHIKAWA, Yoshiaki ESAKI, Takayoshi OZEKI, Jun TOCHIHIRA, Ryu HARADA
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Publication number: 20180141311Abstract: A double-sided metal-clad laminate board includes a first metal layer; a second metal layer, and an insulating layer intervening between the first metal layer and the second metal layer. And the insulating layer is in direct contact with the first metal layer and the second metal layer.Type: ApplicationFiled: January 28, 2016Publication date: May 24, 2018Inventors: TAKAYOSHI OZEKI, YOHSUKE ISHIKAWA, YOSHIAKI ESAKI
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Patent number: 9232636Abstract: The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 ?m, a line width in the range of 50 ?m to 1 mm, and a line gap in the range of 50 ?m to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 ?m. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 ?m or less.Type: GrantFiled: February 18, 2011Date of Patent: January 5, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takayoshi Ozeki, Yohsuke Ishikawa, Yoshiaki Esaki, Hiroyuki Fukusumi
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Publication number: 20130256002Abstract: The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 ?m, a line width in the range of 50 ?m to 1 mm, and a line gap in the range of 50 ?m to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 ?m. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 ?m or less.Type: ApplicationFiled: February 18, 2011Publication date: October 3, 2013Applicant: PANASONIC CORPORATIONInventors: Takayoshi Ozeki, Yohsuke Ishikawa, Yoshiaki Esaki, Hiroyuki Fukusumi