Patents by Inventor Yoichi Babasaki

Yoichi Babasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper foil for printed wiring board
    Patent number: 6544664
    Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: April 8, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Naotomi Takahashi, Yoichi Babasaki, Tsutomu Higuchi, Osamu Nakano, Hiroshi Watanabe, Masaru Takahashi, Makoto Dobashi