Abstract: A method for manufacturing a light emitting device includes: preparing a substrate having a first region and a second region surrounding the first region; mounting a plurality of light emitting elements in the first region; mounting a reinforcement member on the second region; forming and curing a sealing member in contact with the reinforcement member and with the light emitting elements, the sealing member having a lower rigidity than the reinforcement member; and cutting the substrate, the reinforcement member, and the sealing member to separate into individual light emitting devices each including one or more of the light emitting elements.

Abstract: A planar light source includes: a light guide member, a light source including a light-emitting element and a first light adjustment member and being disposed in a first hole of the light guide member, a first light-transmissive member disposed in the first hole between a lateral surface of the light source and the light guide member and on the light source, and a second light adjustment member disposed on the first light-transmissive member. A transmittance of the first light-transmissive member is higher than a transmittance of the first light adjustment member and a transmittance of the second light adjustment member with respect to light emitted from the light source. The first light-transmissive member includes a first light-transmissive portion 1ocated between the first light adjustment member and the second light adjustment member, and a second light-transmissive portion 1ocated between the lateral surface of the light source and the light guide member.

Abstract: A light emitting module includes a light source, a light guide member, and first and second light reflective members. The light guide member is configured to transmit light from the light source. The light guide member having an upper surface and a lower surface opposite to the upper surface. The first light reflective member is arranged on a lower surface side of the light guide member. The first light reflective member has a lower surface. The first light reflective member includes a first resin, and a first reflective body having a refractive index higher than a refractive index of the first resin. The second light reflective member is arranged on a lower surface side of the first light reflective member. The second light reflective member includes a second resin, and a second reflective body having a refractive index lower than a refractive index of the second resin.

Abstract: A planar light source includes: a light guide member, a light source including a light-emitting element and a first light adjustment member and being disposed in a first hole of the light guide member, a first light-transmissive member disposed in the first hole between a lateral surface of the light source and the light guide member and on the light source, and a second light adjustment member disposed on the first light-transmissive member. A transmittance of the first light-transmissive member is higher than a transmittance of the first light adjustment member and a transmittance of the second light adjustment member with respect to light emitted from the light source. The first light-transmissive member includes a first light-transmissive portion 1ocated between the first light adjustment member and the second light adjustment member, and a second light-transmissive portion 1ocated between the lateral surface of the light source and the light guide member.

Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.

Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

Abstract: A method for manufacturing a light emitting device includes: preparing a substrate having a first region and a second region surrounding the first region; mounting a plurality of light emitting elements in the first region; mounting a reinforcement member on the second region; forming and curing a sealing member in contact with the reinforcement member and with the light emitting elements, the sealing member having a lower rigidity than the reinforcement member; and cutting the substrate, the reinforcement member, and the sealing member to separate into individual light emitting devices each including one or more of the light emitting elements.

Abstract: A method for manufacturing a light emitting device, includes: providing a reflective film; providing a light emitting element having a semiconductor stacked layer and electrodes formed at a first main surface side of the light emitting element; pressing the reflective film on the first main surface side to deform the reflective film, and disposing the reflective film on at least a side surface of the light emitting element; and exposing the electrodes of the light emitting element from the reflective film.

Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A method of manufacturing a light emitting device includes providing a reflecting sheet having a first surface and a second surface and defining through-holes; placing a wavelength-converting sheet on a first surface side of the reflecting sheet to cover openings of the through-holes at the first surface side; disposing a light-transmissive adhesive in the through-holes; disposing a light emitting element in each of the through-holes so that a light emitting surface of the light emitting element faces the wavelength converting sheet; fixing the light emitting element in the through-hole via the adhesive; and covering the second surface of the reflecting sheet and an outer surface of the adhesive with a reflecting material.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.