Patents by Inventor Yoichi Daiko

Yoichi Daiko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5565706
    Abstract: A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.
    Type: Grant
    Filed: March 20, 1995
    Date of Patent: October 15, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Miura, Akio Takahashi, Takao Miwa, Masahiro Suzuki, Ryuji Watanabe, Junichi Katagiri, Yoichi Daiko, Tsutomu Imai, Haruo Akahoshi
  • Patent number: 4785675
    Abstract: The present invention relates to a method of and a device for detecting torque, and more particularly to a method of and a device for detecting torque which are suitable for use at the time of a high-velocity rotation or for detecting a very small torque. An annular or ring-like elastic member is interposed between, for instance, a drive shaft and a load shaft constituting a torque-transmitting shaft system, and is formed with slits with parts of an outer periphery thereof left unslitted to be divided in the axial direction so that the member is of a configuration easily deformable in the radial direction thereof by means of torque. A non-contact type displacement sensor is provided for measuring the deformation of the elastic member, and a marker is attached on the drive shaft to provide a positional signal for use as a sampling signal. The signal of the displacement sensor is extracted on the basis of the sampling signal to be stored and held.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: November 22, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Shuuhei Takasu, Takao Terabayashi, Isao Takahashi, Yoichi Daiko
  • Patent number: 4697964
    Abstract: This invention is directed to a boring machine provided with a spindle supported rotatably in a spindle housing, a driving means for rotating the spindle, and a spindle feed mechanism supporting the spindle housing so that the spindle housing can be moved up and down. This boring machine includes a means for detecting the level of axial displacement of the spindle in boring motion with the detecting means not contacting the spindle, and a comparator for comparing the level of the actual axial displacement of the spindle or the thrust force applied thereto and corresponding to this displacement with a predetermined threshold level of axial displacement or a threshold level of thrust force. The spindle feed mechanism is controlled in response to the output from the comparator.
    Type: Grant
    Filed: July 23, 1985
    Date of Patent: October 6, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Yoichi Daiko, Masami Masuda, Takao Terabayashi