Patents by Inventor Yoichi Emura

Yoichi Emura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7624870
    Abstract: A single thin plate storage container 1 includes a main body 2 for storing one thin wafer A4 inside and a lid attached to the main body 2. The single thin plate storage container 1 includes a bottom side support member 35 that is located on the main body 2 side and supports the lid 3 from the bottom side, and a front side support member 36 that is located on the lid 3 side and supports the thin wafer 4A from the upper front side. The bottom side support member 35 includes a center support part 37, an outer periphery support part 38, a peripheral edge support part 39, and a ring plate 40 for combining integrally the center support part 37 and the outer support part 38. The front side support member 36 includes a disc 43 for covering the thin wafer 4A from the upper side and abutting parts 44, 45 to sandwich the thin wafer 4A between the two abutting parts and the bottom side support member 35.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: December 1, 2009
    Assignee: Miraial Co., Ltd.
    Inventors: Koichi Nishizaka, Yoichi Emura, Tadahiro Obayashi
  • Publication number: 20060283772
    Abstract: A single thin plate storage container is provided so that an extremely thin wafer can be safely and reliably supported for easy insertion and removal. A single thin plate storage container 1 includes a main body 2 for storing one thin wafer A4 inside and a lid attached to the main body 2. The single thin plate storage container 1 includes a bottom side support member 35 that is located on the main body 2 side and supports the lid 3 from the bottom side, and a front side support member 36 that is located on the lid 3 side and supports the thin wafer 4A from the upper front side. The bottom side support member 35 includes a center support part 37 for supporting a center of the thin wafer 4A, an outer periphery support part 38 for supporting an outer periphery of the same, a peripheral edge support part 39 for supporting the same radially from outside, and a ring plate 40 for combining integrally the center support part 37 and the outer support part 38.
    Type: Application
    Filed: May 11, 2006
    Publication date: December 21, 2006
    Applicant: MIRAIAL CO., LTD.
    Inventors: Koichi Nishizaka, Yoichi Emura, Tadahiro Obayashi
  • Publication number: 20060278564
    Abstract: When a thin-plate supporting container is placed on a placement table, a displacement is corrected and the thin-plate supporting container is precisely positioned. The thin-plate supporting container includes a container body 22 for housing therein a semiconductor wafer and the like and positioning means 23 provided to the container body 22 for positioning the container body at a set position on a placement table to place the container body on the placement table and take in and out the semiconductor wafer and the like. The positioning means 23 includes an engagement groove 24 for engaging an engagement protrusion provided on the placement table, and an inclined plane 25 to be in contact with the engagement protrusion in a state the engagement groove engages with the engagement protrusion. The inclined plane is treated so as to reduce a contact area with the engagement protrusion to decrease the friction resistance by embossing.
    Type: Application
    Filed: June 1, 2006
    Publication date: December 14, 2006
    Applicant: MIRAIAL CO., LTD.
    Inventors: Tadahiro Obayashi, Yoichi Emura
  • Publication number: 20060243612
    Abstract: A single thin plate storage container is provided so that a housed semiconductor wafer is capable of easy insertion and removal. The single thin plate storage container includes a container body which houses a single semiconductor wafer therein and a lid unit attached to the container body. The container body includes a bottom plate on which the semiconductor wafer is placed and a peripheral wall portion formed around the bottom plate, and the bottom plate is formed by protruding up to a position higher than the peripheral wall portion. The bottom plate of the container body is provided with a plurality of thin plate supporting convex strips for supporting the semiconductor wafer in a state where a space is provided between the semiconductor wafer and the bottom plate. The inner side surface of the top plate of the lid unit is provided with a plurality of retainers which support a peripheral portion of the semiconductor wafer placed on the bottom plate of the container body.
    Type: Application
    Filed: April 4, 2006
    Publication date: November 2, 2006
    Applicant: MIRAIAL CO., LTD.
    Inventors: Koichi Nishizaka, Yoichi Emura, Tadahiro Obayashi