Abstract: A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Abstract: Providing a method for manufacturing a package capable of improving production efficiency.

Abstract: The present invention reduces the value of a bonding width L of a base substrate and a lid substrate in each piezoelectric vibrator. A plurality of lid substrates 3 each including a recess portion 3a are formed and a bonding film is formed on a wafer for lid substrate 50. The wafer for base substrate 40 is opposed and anodic-bonded to the wafer for lid substrate 50 to produce a wafer unit 60 including a plurality of piezoelectric vibrators 1. Then, a microgroove 813 is formed by applying laser along a cutting line for each of the piezoelectric vibrators 1 on the side of the wafer for lid substrate 50, and a sharp pressing blade 830 is pressed on the opposite side, thereby performing sequential cutting.

Abstract: Provided is a piezoelectric vibrator which is also compatible with the miniaturization thereof. In a piezoelectric vibrator where a piezoelectric vibrating piece is sealed in a cavity formed between a lid substrate and a base substrate made of a glass material, one through hole is formed in the base substrate, a pair of through electrodes are arranged in the through hole, the through hole is filled with a glass frit and the glass frit is solidified by baking so that the through hole is sealed by the glass fit. By arranging the pair of through electrodes in one through hole, one through hole is provided for one piezoelectric vibrator and hence, bending strength of the base substrate can be increased. Further, the piezoelectric vibrator is compatible with the miniaturization thereof.

Abstract: A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Abstract: A method of manufacturing a package capable of sealing an electronic component in a cavity formed between a plurality of substrates bonded to each other includes a penetration electrode forming step of forming a penetration electrode which passes through a first substrate of the plurality of substrates in the thickness direction and which electrically connects the inside of the cavity and the outside of the package to each other. The package manufacturing method is characterized in that the penetration electrode forming step includes a through hole forming step of forming a through hole for disposing the penetration electrode in the first substrate and a filling step of filling a filler into the through hole under a decompressed atmosphere.

Abstract: A method of manufacturing a package in which generation of voids in the interior of glass frit is restrained, so that maintenance of hermeticity in a cavity and improvement of mechanical strength of through electrodes are achieved, such a package, a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio timepiece are provided. The invention is characterized by including baking glass frit filled in through holes and solidifying the same, and the baking step is performed by a decompressed atmosphere, which is set to a pressure lower than the atmospheric pressure.

Abstract: A method of manufacturing a piezoelectric vibrator according to the invention includes the steps of: inserting a core portion of a conductive rivet member, which includes a planar base portion and the core portion extending in a direction vertical to the surface of a base portion, into a penetration hole of the base substrate and bringing the base portion of the rivet member into contact with a first surface of the base substrate; applying a paste-like glass frit on a second surface of the base substrate and moving a first squeegee which comes into contact with the second surface with an attack angle in one direction to thereby fill the glass frit in the penetration hole; and moving a second squeegee which comes into contact with the second surface with an attack angle in a direction opposite to the one direction to thereby fill the glass frit applied redundantly on the second surface in the penetration hole.

Abstract: Provided are a crystal substrate etching method capable of processing with high accuracy, a piezoelectric vibrating reed of which the outer shape is formed by the method, a piezoelectric vibrator having the piezoelectric vibrating reed, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezo-electric vibrator. A crystal substrate and an auxiliary substrate are successively dry-etched from a second surface side of the crystal substrate in a state where the auxiliary substrate having approximately the same etching rate as the crystal substrate is bonded to a first surface of the crystal substrate.

Abstract: Provided are a method of manufacturing a package capable of forming a penetration electrode at a low cost without conduction defects while maintaining the airtightness of a cavity, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. In a glass frit application step, a glass frit is applied onto a first surface so that a first opening on the first surface side of a penetration hole is blocked under a depressurized atmosphere in a state where a second surface side of the penetration hole is blocked. In a glass frit filling step, an atmospheric pressure is increased so that the glass frit is filled in the penetration hole by a pressure difference which is generated between the inside of the penetration hole and the outside of the penetration hole.

Abstract: Provided are a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity by suppressing the occurrence of voids in a baked glass, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. The package manufacturing method includes a second glass frit filling step of filling a second glass frit in a penetration hole to be overlapped on a first glass frit and temporarily drying the second glass frit; and a baking step of baking and curing the first and second glass frits filled in the penetration hole. The second particle size of the second glass particles contained in the second glass frit is larger than the first particle size of the first glass particles contained in the first glass frit.

Abstract: Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed on a front surface of a base substrate is anodically bonded to a frame region of a lid substrate. On the outer surface of a package, a protection film made of a material having higher resistance to corrosion than the bonding material is formed so as to cover at least the bonding material exposed between the base substrate and the lid substrate.

Abstract: A package manufacturing method capable of manufacturing a package easily and efficiently. The package manufacturing method includes a jig disposing step of disposing a covering jig covering an outer peripheral portion on one surface of a first board so as to expose a hole forming region through a jig opening formed on the covering jig; and a filling step of filling a filling material constituting at least a part of penetration electrodes into holes. The filling step includes a metal mask disposing step of disposing a metal mask 84 on the covering jig so as to expose the hole forming region through the jig opening and a mask opening of the metal mask; and a main filling step of applying the filling material on the one surface of the first board so as to fill the filling material into the holes using a squeegee.

Abstract: Providing a method for manufacturing a package capable of improving production efficiency.