Patents by Inventor Yoichi Goi

Yoichi Goi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 6130484
    Abstract: A semiconductor device includes a buffer region having buffers and disposed along a side of a semiconductor chip; a pad region having pads corresponding to the buffers and disposed outside the buffer region on the semiconductor chip; signal lines connecting the buffers to corresponding pads; and power supply lines and ground lines connected to extra pads, either of the power supply lines or the ground lines being partially superimposed on part of and separated from the signal lines by insulating layers.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: October 10, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideo Kameda, Naoto Ueda, Yoichi Goi, Hideki Taniguchi
  • Semiconductor integrated circuit
    Patent number: 6066958
    Abstract: There are provided an output buffer circuit and an input/output buffer circuit each including pre-driver circuit and main driver circuit divided to a plurality of stages and a delay circuit and enabling operations of the main driver circuit successively with a delay circuit in the pre-driver circuit.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: May 23, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Taniguchi, Yoichi Goi