Patents by Inventor Yoichi Haruta

Yoichi Haruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6458509
    Abstract: A resist composition comprising: a curable composition mainly comprising (1) at least one of an alkali-soluble acrylic compound and an alkali-soluble methacrylic compound; (2) a fine-particulate crosslinked elastic polymer having a carboxyl group; and (3) an agent for enhancing adhesion with respect to copper.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: October 1, 2002
    Assignee: Toagosei Co., Ltd.
    Inventor: Yoichi Haruta
  • Patent number: 5270493
    Abstract: A multi-layer printed circuit board with self-contained printed resistors includes an undercoat layer made of an insulating material and formed on an outermost conductor circuit at least except for a ground portion of the outermost conductor circuit; an electro-magnetic wave shield layer made of a cured copper paste and formed on the undercoat layer and the ground portion of the outermost conductor circuit so as to cover a generally entire surface of the outermost conductor circuit; and protective overcoat covering an outer surface of the shield layer.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: December 14, 1993
    Assignees: Matsushita Electric Industrial Co., Ltd., Toagosei Chemical Industry Co., Ltd.
    Inventors: Kazuhiko Inoue, Yoichi Haruta, Motohito Yamanaka, Yuji Kawada