Patents by Inventor Yoichi Hitomi
Yoichi Hitomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170103777Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: December 23, 2016Publication date: April 13, 2017Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
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Patent number: 9586343Abstract: In the method, a sidewall pattern is formed in a side wall of a first resist pattern that is formed on a second hard mask layer of a base material in which first and second hard mask layers are laminated in the order of description, a second hard mask pattern is formed by etching the second hard mask layer by using the sidewall pattern as a mask, a first hard mask pattern is formed by etching the first hard mask layer by using, as a mask, the second hard mask pattern and a second resist pattern that is formed on the first hard mask layer of the base material, and the first and second fine patterns are formed by etching the base material by using the first hard mask pattern as a mask.Type: GrantFiled: November 29, 2013Date of Patent: March 7, 2017Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Takeshi Sakamoto, Yusuke Kawano, Mikio Ishikawa, Yoichi Hitomi
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Patent number: 9564153Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: GrantFiled: November 24, 2014Date of Patent: February 7, 2017Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Publication number: 20160167256Abstract: In the method, a sidewall pattern is formed in a side wall of a first resist pattern that is formed on a second hard mask layer of a base material in which first and second hard mask layers are laminated in the order of description, a second hard mask pattern is formed by etching the second hard mask layer by using the sidewall pattern as a mask, a first hard mask pattern is formed by etching the first hard mask layer by using, as a mask, the second hard mask pattern and a second resist pattern that is formed on the first hard mask layer of the base material, and the first and second fine patterns are formed by etching the base material by using the first hard mask pattern as a mask.Type: ApplicationFiled: November 29, 2013Publication date: June 16, 2016Inventors: Takeshi SAKAMOTO, Yusuke KAWANO, Mikio ISHIKAWA, Yoichi HITOMI
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Publication number: 20150079424Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: November 24, 2014Publication date: March 19, 2015Inventors: Yoichi HITOMI, Shinji KUMON, Terutoshi MOMOSE, Katsuya SAKAYORI, Kiyohiro TAKACHI, Yoichi MIURA, Tsuyoshi YAMAZAKI
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Patent number: 8927122Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: GrantFiled: April 14, 2008Date of Patent: January 6, 2015Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Patent number: 8623751Abstract: A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.Type: GrantFiled: May 8, 2012Date of Patent: January 7, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventors: Koichi Nakayama, Yoichi Hitomi, Takamasa Takano
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Patent number: 8399774Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.Type: GrantFiled: November 23, 2011Date of Patent: March 19, 2013Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
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Patent number: 8198726Abstract: A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.Type: GrantFiled: December 1, 2009Date of Patent: June 12, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Koichi Nakayama, Yoichi Hitomi, Takamasa Takano
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Publication number: 20120090878Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.Type: ApplicationFiled: November 23, 2011Publication date: April 19, 2012Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi HITOMI, Hiroaki MIYAZAWA, Shinji KUMON, Terutoshi MOMOSE
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Patent number: 8097811Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.Type: GrantFiled: April 4, 2008Date of Patent: January 17, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
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Patent number: 8040634Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.Type: GrantFiled: July 14, 2006Date of Patent: October 18, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroaki Miyazawa, Terutoshi Momose, Yoichi Hitomi, Tsuyoshi Yamazaki
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Publication number: 20100164120Abstract: A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.Type: ApplicationFiled: December 1, 2009Publication date: July 1, 2010Applicant: DAI Nippon Printing Co., Ltd.Inventors: Koichi Nakayama, Yoichi Hitomi, Takamasa Takano
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Publication number: 20100047626Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, a conductor layer 3 formed on the insulating layer 2, and a cover layer 4 covering the conductor layer 3. The insulating layer 2 and the cover layer 4 are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10?6/% RH and 30×10?6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10?6/% RH or less.Type: ApplicationFiled: April 14, 2008Publication date: February 25, 2010Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Shinji Kumon, Terutoshi Momose, Katsuya Sakayori, Kiyohiro Takachi, Yoichi Miura, Tsuyoshi Yamazaki
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Publication number: 20090310260Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.Type: ApplicationFiled: July 14, 2006Publication date: December 17, 2009Inventors: Hiroaki Miyazawa, Terutoshi Momose, Yoichi Hitomi, Tsuyoshi Yamazaki
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Publication number: 20080247131Abstract: A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, having an opening for grounding terminal 3, and a grounding conductor 4 formed on the insulating layer 2. A grounding-terminal-forming material 5 is placed in the opening for grounding terminal 3 to form a grounding terminal 7 that connects the metallic substrate 1 and the grounding conductor 4. The grounding conductor 4 does not surround a portion 8 of the circumference of the opening for grounding terminal 3.Type: ApplicationFiled: April 4, 2008Publication date: October 9, 2008Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Hitomi, Hiroaki Miyazawa, Shinji Kumon, Terutoshi Momose
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Publication number: 20040101666Abstract: An inspection contact sheet for electronic device inspection comprises a three-layer base sheet formed by laminating protective films to both the surfaces of an insulating rubber layer, conductive rubber parts having rubber elasticity and penetrating the base sheet perpendicularly to the surfaces of the base sheet. One of the surfaces of the base sheet is provided with contact pads to be brought into contact with the terminals of the electronic device, and the other surface of the base sheet is provided with contact pads to be brought into direct contact with the terminals of an electronic circuit inspecting circuit member or wiring lines. The terminal pads or the wiring lines have an area greater than the sectional area of the conductive rubber parts.Type: ApplicationFiled: September 5, 2003Publication date: May 27, 2004Applicant: Dai Nippon Prtg. Co., Ltd.Inventors: Kunihiro Tsubosaki, Hiroaki Miyazawa, Yoichi Hitomi, Masahiro Nagata, Takahiro Sahara, Masahiro Fuse
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Patent number: 6201292Abstract: There is disclosed a resin-sealed semiconductor device in which plural terminal portions each integrally having an inner terminal on a surface and an outer terminal on a rear face are arranged two-dimensionally substantially in a plane electrically independent of one another. A die pad is electrically independently disposed in a substantially middle portion in the plane where the terminal portions are arranged two-dimensionally. A semiconductor element is mounted on the die pad. The inner terminals of the terminal portions are electrically connected via wires to terminals of the semiconductor element, and the entirety is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside. Therefore, an occupancy ratio of the semiconductor element in the semiconductor device is increased. The semiconductor device can be miniaturized. The mounting density onto a circuit substrate can be enhanced.Type: GrantFiled: April 1, 1998Date of Patent: March 13, 2001Assignee: Dai Nippon Insatsu Kabushiki KaishaInventors: Hiroshi Yagi, Yoichi Hitomi, Makoto Nakamura, Masato Sasaki