Abstract: A vehicle includes a regenerative brake of a rotating electric machine and a friction brake which is a mechanical brake as braking means for applying a braking force to rotations of the left and right wheels at the front and rear of the vehicle. The vehicle also includes an SOC information obtaining part that obtains an amount of charge (SOC) of a battery of the vehicle and an ECU. The ECU may include a VSA modulator and an ACC-ECU that generate, without a braking operation of the driver, a regenerative braking force with the regenerative brake and a friction braking force with the friction brake. The ECU prohibits an operation of the VSA modulator and/or an operation of the ACC-ECU according to a temperature of the friction brake and the amount of charge (SOC) of the battery.

Abstract: A film forming method is constituted by forming a silicon oxide film on a substrate by causing silicon generated by sputtering with silicon as a target to be incident on the substrate from an oblique direction while supplying oxygen gas onto the substrate.

Abstract: In a thin-film formation process and system, a target and a substrate are placed in a sputtering space and a film-forming space, respectively, the pressure in the film-forming space is maintained at a pressure lower than the pressure in the sputtering space and a pressure sufficient for sputtered particles to move in the film-forming space with their mean free path which is longer than the distance between the grid plate and the substrate, and the target is sputtered to form a thin film on the substrate.

Abstract: In a thin-film formation process and system, a target and a substrate are placed in a sputtering space and a film-forming space, respectively, the pressure in the film-forming space is maintained at a pressure lower than the pressure in the sputtering space and a pressure sufficient for sputtered particles to move in the film-forming space with their mean free path which is longer than the distance between the grid plate and the substrate, and the target is sputtered to form a thin film on the substrate.