Patents by Inventor Yoichi ISOZUMI

Yoichi ISOZUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor apparatus and semiconductor device
    Patent number: 11658081
    Abstract: A semiconductor apparatus includes a mounting board, a system on chip (SOC) package and a memory package which are provided on the mounting board. The SOC package includes a semiconductor chip and a package substrate on which the semiconductor chip is mounted. The semiconductor apparatus further includes a signal wiring line through which a signal between the semiconductor chip and the memory package is transmitted, being provided on the package substrate and in the mounting board and a measurement terminal connected to the signal wiring line on main surface of the package substrate.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: May 23, 2023
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Yoichi Isozumi, Takafumi Betsui, Shuuichi Kariyazaki
  • SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE
    Publication number: 20220375804
    Abstract: A semiconductor apparatus includes a mounting board, a system on chip (SOC) package and a memory package which are provided on the mounting board. The SOC package includes a semiconductor chip and a package substrate on which the semiconductor chip is mounted. The semiconductor apparatus further includes a signal wiring line through which a signal between the semiconductor chip and the memory package is transmitted, being provided on the package substrate and in the mounting board and a measurement terminal connected to the signal wiring line on main surface of the package substrate.
    Type: Application
    Filed: May 21, 2021
    Publication date: November 24, 2022
    Inventors: Yoichi ISOZUMI, Takafumi BETSUI, Shuuichi KARIYAZAKI