Abstract: There is provided a copper powder containing an organic compound containing carbon and nitrogen. The powder has a ratio of carbon content PC (mass %) to specific surface area SSA (m2/g), PC/SSA, of 0.005 to 0.1 and a ratio of nitrogen content PN (mass %) to specific surface area SSA (m2/g), PN/SSA, of 0.001 to 0.05. The organic compound preferably contains two or more of nitrogen atom per molecule and is preferably capable of forming a five-membered ring complex with copper. The organic compound preferably includes one or more of dimethyl glyoxime, ethylenediamine, and polyethyleneimine.

Abstract: Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 ?m, having a ratio of D to DBET, D/DBET, of 0.8 to 4.0 wherein DBET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mixing (1) hydrazine and (2) a reactant mixture including a monovalent or divalent copper source and a liquid medium which includes water and an organic solvent having water miscibility and capable of reducing the surface tension of water, to reduce the copper source to form copper particles.

Abstract: Provided is a bonding joining structure in which a heat generating body and a support including a metal are joined to each other via a joint portion composed of a sintered body of copper powder. The support contains copper or gold, the copper or gold being present in at least an outermost surface of the support. An interdiffusion portion in which copper or gold contained in the support and copper contained in the sintered body is formed so as to straddle a bonding interface between the support and the sintered body. Preferably, a copper crystal structure having the same crystal orientation is formed in the interdiffusion portion so as to straddle the bonding interface.

Abstract: Provided is a bonding joining structure in which a heat generating body and a support including a metal are joined to each other via a joint portion composed of a sintered body of copper powder. The support contains copper or gold, the copper or gold being present in at least an outermost surface of the support. An interdiffusion portion in which copper or gold contained in the support and copper contained in the sintered body is formed so as to straddle a bonding interface between the support and the sintered body. Preferably, a copper crystal structure having the same crystal orientation is formed in the interdiffusion portion so as to straddle the bonding interface.

Abstract: There is provided a copper powder containing an organic compound containing carbon and nitrogen. The powder has a ratio of carbon content PC (mass %) to specific surface area SSA (m2/g), PC/SSA, of 0.005 to 0.1 and a ratio of nitrogen content PN (mass %) to specific surface area SSA (m2/g), PN/SSA, of 0.001 to 0.05. The organic compound preferably contains two or more of nitrogen atom per molecule and is preferably capable of forming a five-membered ring complex with copper. The organic compound preferably includes one or more of dimethyl glyoxime, ethylenediamine, and polyethyleneimine.

Abstract: Provided is a conductor connection structure (10) in which two conductors (21, 31) are electrically connected by a copper connection part (11). The connection part (11) comprises a material containing mainly copper. The connection part (11) also comprises a plurality of holes. An organosilicon compound is present within the holes. The connection part preferably has a structure in which a plurality of gathered particles are melted and bonded together and the particles have a necking section therebetween.

Abstract: Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 ?m, having a ratio of D to DBET, D/DBET, of 0.8 to 4.0 wherein DBET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mixing (1) hydrazine and (2) a reactant mixture including a monovalent or divalent copper source and a liquid medium which includes water and an organic solvent having water miscibility and capable of reducing the surface tension of water, to reduce the copper source to form copper particles.

Abstract: A nickel ink having nickel particles dispersed in a dispersion medium is disclosed. The dispersion medium comprises one member or a combination of two or more members selected from the group consisting of an alcohol and a glycol both having a boiling point of 300° C. or lower at atmospheric pressure. The nickel particles have an average primary particle size of 50 nm or smaller. The nickel ink provides a conductor film with a surface smoothness having an average surface roughness Ra of 10 nm or smaller and a maximum surface roughness Rmax of 200 nm or smaller.

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.

Abstract: Disclosed is a nickel ink comprising a dispersion medium and nickel particles dispersed in the medium and containing a methyldimethoxysilane coupling agent. The dispersion medium comprises a glycol having a boiling point of 300° C. or lower at ambient temperature, an alkoxyethanol having 3 to 10 carbon atoms, and an ether having 2 to 8 carbon atoms. The ink preferably has a surface tension adjusted to 15 to 50 mN/m and a viscosity at 25° C. adjusted to 0.6 to 60 mPa·sec. The ink is preferably used in inkjet printing.

Abstract: The invention relates to an electrically conductive ink comprising fine metal particles, an inorganic binder, and a solvent. The inorganic binder comprises a coupling agent containing Ti or Al or a chelate containing Ti or Al. It is preferred that the inorganic binder is present in an amount of 1 to 50 parts by weight per 100 parts by weight of the fine metal particles in the conductive ink. An electrical conductor thin film is produced by the process of printing the conductive ink on a substrate to form a printed pattern by additive processing and firing the printed pattern at 100° C. to 950° C.

Abstract: An object of the invention is to provide a conductive metal ink having an excellent adhesion to various kinds of substrates such as a glass substrate, and making it possible to form fine wiring or electrodes. Another object is to provide a conductive ink which can be used for ink jet printing system etc. For the purpose of achieving the objects, a conductive ink comprising a solvent, a metal powder, and an adhesion improver, which is characterized in that the adhesion improver is one or mixture selected from the group consisting of a silane coupling agent, a titanium coupling agent, a zirconium coupling agent, and an aluminum coupling agent. is adopted. Furthermore, a surface tension of the solvent is adjusted to be in the range of 15 mN/m to 50 mN/m with a surface tension adjustor to provide conductive ink suitable for ink jet printing system etc.

Abstract: A nickel ink having nickel particles dispersed in a dispersion medium is disclosed. The dispersion medium comprises one member or a combination of two or more members selected from the group consisting of an alcohol and a glycol both having a boiling point of 300° C. or lower at atmospheric pressure. The nickel particles have an average primary particle size of 50 nm or smaller. The nickel ink provides a conductor film with a surface smoothness having an average surface roughness Ra of 10 nm or smaller and a maximum surface roughness Rmax of 200 nm or smaller.

Abstract: Disclosed is a nickel ink which is obtained by dispersing nickel particles in a dispersion medium. This nickel ink contains a methyldimethoxysilane coupling agent. The dispersion medium contains a glycol having a boiling point at room temperature of not more than 300 & ring; C, an alkoxyethanol having 3-10 carbon atoms, and an ether having carbon atoms. The ink is preferably controlled to have a surface tension of 15-50 mN/m and a viscosity at 25 & ring; C of 0.6-60 mPa-sec. This ink is preferably used in inkjet printing systems.

Abstract: A carrier for electrophotographic developer comprises a resin carrier core comprising a binder resin and magnetic powder dispersed in the binder resin, and a coating layer comprising a coating resin on a surface of the core, the binder resin being a silicone resin obtained by curing of a polysiloxane compound (A) having an epoxy group and a polysiloxane compound (B) having a group capable of reacting with the epoxy group, due to a ring-opening addition reaction; the binder resin containing a functional group which is an epoxy group and/or a group capable of reacting with an epoxy group; the coating resin containing a functional group capable of reacting with the functional group of the binder resin; the functional group of the coating resin and the function group of the binder resin forming a chemical bond.

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.

Abstract: It is an object to provide a conductive paste which has not only sufficient adhesion to a polyimide as a substrate, but also good in both folding endurance and solvent resistance. To achieve the above object, the conductive paste comprises a conductive powder and a binder resin which is characterized in that the binder resin is an epoxy resin composition containing an aluminum compound and a silane coupling agent. The epoxy resin composition is preferred to contain the epoxy resin at 2 to 20 parts by weight, the aluminum compound at 0.01 to 3.0 parts by weight and the silane coupling agent at 0.01 to 3.0 parts by weight.

Abstract: Provided are a carrier for electrophotography developers prepared by generating a slight amount of byproducts such as water, alcohol, etc, which carrier is free from release of a magnetic powder, has excellent mechanical strength and durability, and good environmental stability, and further can restrain occurrence of toner spent condition and has favorable fluidity and excellent capability of imparting charging to a toner, a two-component developer comprising the carrier and a method for forming an image using the developer. The carrier for electrophotography developers comprises a magnetic powder dispersed binder resin, the binder resin material comprises (A) a polysiloxane compound having an epoxy group as a functional group and (B) a polysiloxane compound having a group capable of ring-opening addition reaction with the epoxy group of the polysiloxane compound (A), and the binder resin is a silicone resin prepared by curing with ring-opening addition reaction of the epoxy resin.

Abstract: A carrier for electrophotographic developer comprises a resin carrier core comprising a binder resin and magnetic powder dispersed in the binder resin, and a coating layer comprising a coating resin on a surface of the core, the binder resin being a silicone resin obtained by curing of a polysiloxane compound (A) having an epoxy group and a polysiloxane compound (B) having a group capable of reacting with the epoxy group, due to a ring-opening addition reaction; the binder resin containing a functional group which is an epoxy group and/or a group capable of reacting with an epoxy group; the coating resin containing a functional group capable of reacting with the functional group of the binder resin; the functional group of the coating resin and the functional group of the binder resin forming a chemical bond.

Abstract: Provided are a carrier for electrophotography developers prepared with generating a slight amount of byproducts such as water, alcohol, etc, which carrier is free from release of a magnetic powder, has excellent mechanical strength and durability, and good environmental stability, and further can restrain occurrence of toner spent condition and has favorable fluidity and excellent capability of imparting charging to a toner, a two-component developer comprising the carrier and a method for forming an image using the developer.