Abstract: A switch module is disclosed for semiconductor characteristic measurement and a semiconductor characteristic measurement method is disclosed with which the impact of the recovery effect after stress signal elimination is reduced in BTI testing. The switch module for semiconductor characteristic measurement includes a first input terminal for receiving stress signals from a stress signal source, a second input terminal for receiving signals from a first non-stress signal source, a first output terminal for outputting output signals, and a switch part for controlling the connection of the first output terminal and the first input terminal or the second input terminal, wherein the switch part detects a first voltage transition of the signals transmitted to the second input terminal and modifies the connection.

Abstract: A method for finding the impedance of a device under test using an impedance measuring apparatus having a modem-type auto-balancing bridge, two or more measurement signals, each of which has a different phase with respect to the reference signals supplied to the modem inside said auto-balancing bridge, are applied to a device under test; the impedance of this device under test is measured when each of the measurement signals is applied to the device under test; and the impedance of this device under test is found using the above-mentioned phase and the impedance measurement value of each of these measurements.

Abstract: A method for finding the impedance of a device under test using an impedance measuring apparatus having a modem-type auto-balancing bridge, two or more measurement signals, each of which has a different phase with respect to the reference signals supplied to the modem inside said auto-balancing bridge, are applied to a device under test; the impedance of this device under test is measured when each of the measurement signals is applied to the device under test; and the impedance of this device under test is found using the above-mentioned phase and the impedance measurement value of each of these measurements.

Abstract: For measuring the inductance of a workpiece, a device which includes an inductance meter, respective D.C. and A.C. power sources as well as a guard line circuit. In order to simulate conditions of actual use of the workpiece, the D.C. power source is connected to provide a direct current bias through the workpiece. A measuring current produced by the A.C. power source and applied to the workpiece is detected via the inductance meter. The guard line circuit is coupled so as to prevent any portions of the A.C. measuring signal from undesirably flowing through the D.C. power source.

Abstract: The present invention relates to apparatus for measuring the AC electrical parameters of a circuit element (Device-Under-Test, DUT), such as a resistor, a capacitor or an inductor, at the desired frequency of a signal while applying a DC bias to the DUT. The present invention provides an apparatus capable of measurement with less error even in the lower-frequency range.