Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.

Abstract: A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.

Abstract: An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.

Abstract: A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.

Abstract: An electronic component includes a first ceramic substrate having a first principal surface on the upper side and a second principal surface on the lower side, a multilayer body constituted by a plurality of insulator layers each made of a material containing resin and laminated on the first principal surface, a first coil disposed in and/or on the multilayer body, a first relay conductor connected to the first coil, and a first outer electrode disposed on the first ceramic substrate and electrically connected to the first relay conductor. The plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion, the first relay conductor is disposed in the first cut-away portion, and the plurality of insulator layers include a second insulator layer that is contacted with the first relay conductor from below.

Abstract: A coil component comprising a coil conductor layer wound on a plane, an outer-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an outer-circumferential end of the coil conductor layer, and an inner-circumferential lead-out conductor led out on the same plane as the coil conductor layer from an inner-circumferential end of the coil conductor layer. The coil component further comprises a branch conductor disposed to branch from at least one of the outer-circumferential lead-out conductor and the inner-circumferential lead-out conductor, and extending on the same plane as the coil conductor layer.

Abstract: An electronic component includes a body, a first inductor, and a low expansion portion. The body includes a laminated body including a plurality of insulating layers laminated in a lamination direction. The insulating layers contain a first resin as a material. The first inductor includes a first inductor conductor layer that adjoins one of the insulating layers. The low expansion portion has a coefficient of linear expansion lower than a coefficient of linear expansion of the plurality of insulating layers. The low expansion portion contains a second resin as a material. At least part of the low expansion portion is embedded in the laminated body. The second resin has a coefficient of linear expansion that is lower than a coefficient of linear expansion of the first resin.

Abstract: An electronic component includes a first ceramic substrate having a first principal surface on the upper side and a second principal surface on the lower side, a multilayer body constituted by a plurality of insulator layers each made of a material containing resin and laminated on the first principal surface, a first coil disposed in and/or on the multilayer body, a first relay conductor connected to the first coil, and a first outer electrode disposed on the first ceramic substrate and electrically connected to the first relay conductor. The plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion, the first relay conductor is disposed in the first cut-away portion, and the plurality of insulator layers include a second insulator layer that is contacted with the first relay conductor from below.

Abstract: An inductor manufacturing method includes a first step of press bonding a Cu foil onto a non-magnetic resin sheet, a second step of forming a conductor pattern by performing etching on the Cu foil, a third step of press bonding another non-magnetic resin sheet onto the conductor pattern, and a via conductor formation step of forming a via conductor that penetrates through the other resin sheet and leads to the conductor pattern. The method further includes a step of forming a body in which resin having magnetism is provided outside of a coil, by press bonding magnetic-powder-containing resin sheets onto a multilayer body, obtained by a manufacturing method including the first to third steps and the via conductor formation step, and then thermally curing the magnetic-powder-containing resin sheets.

Abstract: An inductor manufacturing method includes a first step of press bonding a Cu foil onto a non-magnetic resin sheet, a second step of forming a conductor pattern by performing etching on the Cu foil, a third step of press bonding another non-magnetic resin sheet onto the conductor pattern, and a via conductor formation step of forming a via conductor that penetrates through the other resin sheet and leads to the conductor pattern. The method further includes a step of forming a body in which resin having magnetism is provided outside of a coil, by press bonding magnetic-powder-containing resin sheets onto a multilayer body, obtained by a manufacturing method including the first to third steps and the via conductor formation step, and then thermally curing the magnetic-powder-containing resin sheets.

Abstract: An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.

Abstract: An electronic component having a coil includes a laminated body formed by laminating a plurality of magnetic body layers. The coil is formed by connecting coil electrodes in the laminated body. Nonmagnetic body layers are disposed on the laminated body to have a gap with the coil when seen in a plan view from a coil axis direction of the coil. The embodiment of an electronic component has a stair-like direct-current superposition characteristic.

Abstract: An electronic component capable of adjusting the number of turns of a coil without preparing multiple kinds of inner conductors to be positioned at an end of the layer direction is composed of a multilayer body having multiple laminated magnetic layers. A spiral coil includes inner conductors and via-hole conductors connected to each other. Each of the inner conductors has a length of one turn. Both ends of each of the inner conductors are over points A and B. The inner conductor provided at the most negative side in the z-axis direction branches at one end so as to be over the points A and B.

Abstract: An electronic component capable of adjusting the number of turns of a coil without preparing multiple kinds of inner conductors to be positioned at an end of the layer direction is composed of a multilayer body having multiple laminated magnetic layers. A spiral coil includes inner conductors and via-hole conductors connected to each other. Each of the inner conductors has a length of one turn. Both ends of each of the inner conductors are over points A and B. The inner conductor provided at the most negative side in the z-axis direction branches at one end so as to be over the points A and B.

Abstract: An open magnetic circuit multilayer coil component includes a laminate with magnetic layers, a coil, and a nonmagnetic layer provided within the laminate so as to cross a magnetic path formed by energization of the coil. A nonmagnetic material constituting the nonmagnetic layer is a Zn—Cu-based ferrite nonmagnetic material, and a magnetic material constituting the magnetic layer is a magnetic material containing 100 parts by weight of an Ni—Zn—Cu-based magnetic ferrite material and 0.1 to 2.0 parts by weight, in terms of Co3O4, of Co added to the Ni—Zn—Cu-based magnetic ferrite material.

Abstract: An electronic component having a coil includes a laminated body formed by laminating a plurality of magnetic body layers. The coil is formed by connecting coil electrodes in the laminated body. Nonmagnetic body layers are disposed on the laminated body to have a gap with the coil when seen in a plan view from a coil axis direction of the coil. The embodiment of an electronic component has a stair-like direct-current superposition characteristic.

Abstract: An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.

Abstract: An open magnetic circuit multilayer coil component includes a laminate with magnetic layers, a coil, and a nonmagnetic layer provided within the laminate so as to cross a magnetic path formed by energization of the coil. A nonmagnetic material constituting the nonmagnetic layer is a Zn—Cu-based ferrite nonmagnetic material, and a magnetic material constituting the magnetic layer is a magnetic material containing 100 parts by weight of an Ni—Zn—Cu-based magnetic ferrite material and 0.1 to 2.0 parts by weight, in terms of Co3O4, of Co added to the Ni—Zn—Cu-based magnetic ferrite material.