Abstract: An ozone generator (100) includes: a flow path (1) through which gas flows from an inlet (5) to an outlet (6); an ozone generation unit (3) disposed in the flow path (1); and an ozone sensor (4) disposed in the flow path (1) and upstream of the ozone generation unit (3). The flow path (1) has an upstream-side flow path (130) that forms a gas passing space (AR) located upstream of the ozone generation unit (3) and through which the gas flows from one side to another side in a predetermined direction. The inlet (5) is disposed closer to an outer circumferential portion (131) of the upstream-side flow path (130) than the ozone sensor (4).

Abstract: A data transfer processing system constructed so that a transmission side system transfers continuously renewed data information disposed in a prescribed data pattern to a reception side system, wherein the transmission side system is provided with a functional part for specifying records containing the data information remaining as is as valid data even after renewal and a functional part for transferring pre-renewal and post-renewal disposition information of the specified records to the reception side system and transferring the records changed by the renewal to the reception side system in accordance with a prescribed order and wherein the reception side system is provided with a functional part for invalidating records other than the records which the transferred pre-renewal disposition information indicates, a functional part for rearranging the records not invalidated at locations indicated by the transferred post-renewal disposition information, and a functional part for writing the transferred record

Abstract: A heat sink/circuit board assembly allows repairing or inspection of circuit or parts without impairing heat-radiating effect. A sub-heat sink is protruded from a lateral end of the circuit board in a direction parallel to the main surface of the circuit board and is connected to the main heat sink at its protruding portion. The diameter of the opening of the recessed portion of the main heat sink facing the circuit board is made larger than outer diameter of the circuit board. When circuit elements on the main surface of the circuit board facing the recessed portion of the main heat sink are to be repaired or inspected, the main heat sink is connected to the sub-heat sink on a main surface which is on the opposite side to the surface carrying the circuit elements, while the same heat-radiating effect as in the normal condition can be obtained.