Abstract: A coil substrate includes a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series.

Abstract: A coil substrate includes a substrate, a coil-shaped wiring provided on one surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other, and an insulating layer formed between the adjacent parts of the coil-shaped wiring. The coil-shaped wiring includes a first wiring, and a second wiring that is layered on the first wiring and has a thickness greater than a thickness of the first wiring. A space is provided between a side surface of the first wiring and the insulating layer. The second wiring fills the space and covers the first wiring. Both side surfaces of the second wiring contact the insulating layer.

Abstract: A coil substrate includes a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series.

Abstract: A method of manufacturing a coil substrate, includes forming a plurality of structures, each of the structures including a first insulating layer and a metal layer formed on the first insulating layer; forming a stacked structure by stacking the structures while connecting the metal layers of the adjacent structures in series; and shaping the stacked structure such that the metal layers of the structures are shaped at the same time to be in shapes of wirings, each becomes a part of a spiral-shaped coil, to form the spiral-shaped coil in which the wirings of the adjacent structures are connected in series.

Abstract: A coil substrate includes a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series.

Abstract: A coil substrate includes a substrate, a coil-shaped wiring provided on one surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other, and an insulating layer formed between the adjacent parts of the coil-shaped wiring. The coil-shaped wiring includes a first wiring, and a second wiring that is layered on the first wiring and has a thickness greater than a thickness of the first wiring. A space is provided between a side surface of the first wiring and the insulating layer. The second wiring fills the space and covers the first wiring. Both side surfaces of the second wiring contact the insulating layer.