Patents by Inventor Yoichi Sawada

Yoichi Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11065764
    Abstract: A method of generating a robot operation command includes extracting a work command from an overall work flow; extracting, from a command definition database, a command definition corresponding to the extracted work command, the work command having been read; generating, by referring to the read work command, a set of unit jobs in which at least one work command is arranged in order, based on the extracted command definition; generating, for a plurality of unit jobs, a connecting job for causing a robot to be moved from an end position of a previous unit job to a start position of a subsequent unit job; and generating a robot operation command in which the unit jobs and the connecting job are continuous.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: July 20, 2021
    Assignee: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Yoichi Kakisaka, Yukio Hashiguchi, Hirokazu Kariyazaki, Takashi Nagasaki, Yukiko Sawada, Keita Morisaki
  • Publication number: 20210203366
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Application
    Filed: March 11, 2021
    Publication date: July 1, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20210184704
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a filter that is on the first principal surface and connected to the antenna connection terminal, wherein the filter includes one or more inductors and one or more capacitors, and is configured to allow a transmission signal and a reception signal to pass through; and a reception low noise amplifier on the second principal surface and configured to amplify the reception signal.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 17, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Yukiya YAMAGUCHI
  • Publication number: 20210167803
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission input terminal; a first transmission amplifier disposed on the first principal surface that amplifies a transmission signal input through the transmission input terminal; and a first switch disposed on the second principal surface that connects and disconnects the transmission input terminal and the first transmission amplifier.
    Type: Application
    Filed: November 27, 2020
    Publication date: June 3, 2021
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kunitoshi HANAOKA, Yoichi SAWADA
  • Patent number: 11005505
    Abstract: There is provided a radio-frequency module that can reduce communication signal loss in both the case of employing one communication band of multiple communication bands and the case of employing two or more communication bands together. A radio-frequency module includes a first switching circuit and matching circuits. The matching circuits are provided individually for a first transmission path, a second transmission path, and a third transmission path. When communications are performed by using only a first communication band, the first switching circuit selects the first transmission path. When communications are performed by using together the first communication band and the second communication band, the first switching circuit selects the second transmission path and the third transmission path.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: May 11, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoichi Sawada
  • Publication number: 20210136186
    Abstract: A radio frequency module includes: a module substrate that includes a principal surface on which external-connection terminals are disposed; a power amplifier that is disposed on the principal surface of the module substrate and amplifies a radio frequency transmission signal; and a heat dissipator that dissipates heat of the power amplifier. The heat dissipator includes: a heat dissipation plate that covers a surface of the power amplifier which is opposite to a surface that faces the module substrate; and at least a first leg that extends from the heat dissipation portion toward the principal surface of the module substrate.
    Type: Application
    Filed: October 23, 2020
    Publication date: May 6, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Hiroshi NISHIKAWA, Yukiya YAMAGUCHI
  • Patent number: 10979087
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: April 13, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
  • Patent number: 10972593
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier configured to amplify a transmission signal; a reception low noise amplifier configured to amplify a reception signal; and a second inductor which is a chip inductor disposed on one of a transmission path connecting the diplexer and the transmission power amplifier and a reception path connecting the diplexer and the reception low noise amplifier. The first inductor is mounted on the first principal surface, and the second inductor is mounted on the second principal surface.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoichi Sawada
  • Publication number: 20210091801
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20210091798
    Abstract: A radio frequency module includes a mounting board, a power amplifier, a plurality of transmission filters, a first switch, an output matching circuit, a low-noise amplifier, and an external-connection terminal. The mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board. The first switch switches a connection between the power amplifier and the transmission filters. The output matching circuit is connected between the power amplifier and the first switch. The low-noise amplifier is disposed on the second principal surface of the mounting board. The external-connection terminal is disposed on the second principal surface of the mounting board. The power amplifier, the output matching circuit, the first switch, and the transmission filters are disposed on the mounting board in stated order in a direction that is orthogonal to a thickness direction of the mounting board.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Yoichi SAWADA
  • Publication number: 20210091803
    Abstract: A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Morio TAKEUCHI, Yukiya YAMAGUCHI, Yoichi SAWADA
  • Publication number: 20210091800
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Application
    Filed: September 1, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Takayuki SHINOZAKI, Yukiya YAMAGUCHI
  • Publication number: 20210091802
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier; and a first circuit component disposed on a transmission path connecting the diplexer and the transmission power amplifier. The first inductor is disposed on the first principal surface, and one of the transmission power amplifier and the first circuit component is disposed on the second principal surface.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yoichi SAWADA, Takayuki SHINOZAKI, Yukiya YAMAGUCHI
  • Publication number: 20210091807
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20210092213
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission input terminal, an antenna connection terminal, and a transmission power amplifier. At least one of one or more first circuit components that are disposed on a transmission input path connecting the transmission input terminal and the transmission power amplifier is mounted on the first principal surface, and at least one of one or more second circuit components that are disposed on a first transmission output path or a second transmission output path each connecting an output terminal of the transmission power amplifier and the antenna connection terminal is mounted on the second principal surface.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yoichi SAWADA
  • Publication number: 20210092214
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier configured to amplify a transmission signal; a reception low noise amplifier configured to amplify a reception signal; and a second inductor which is a chip inductor disposed on one of a transmission path connecting the diplexer and the transmission power amplifier and a reception path connecting the diplexer and the reception low noise amplifier. The first inductor is mounted on the first principal surface, and the second inductor is mounted on the second principal surface.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Yoichi SAWADA
  • Publication number: 20210091796
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 25, 2021
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takayuki SHINOZAKI, Yukiya YAMAGUCHI, Morio TAKEUCHI, Yoichi SAWADA
  • Publication number: 20200021318
    Abstract: There is provided a radio-frequency module that can reduce communication signal loss in both the case of employing one communication band of multiple communication bands and the case of employing two or more communication bands together. A radio-frequency module includes a first switching circuit and matching circuits. The matching circuits are provided individually for a first transmission path, a second transmission path, and a third transmission path. When communications are performed by using only a first communication band, the first switching circuit selects the first transmission path. When communications are performed by using together the first communication band and the second communication band, the first switching circuit selects the second transmission path and the third transmission path.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Inventor: Yoichi SAWADA
  • Patent number: 10070513
    Abstract: A high-frequency module includes: a power receiving terminal; an LNA, a reception switch that switches among a plurality of signals in different bands and outputs the signals to the LNA; a first conduction path spanning from the power receiving terminal to a power source terminal of the reception switch; a second conduction path spanning from a branching point in the first conduction path to a power source terminal of the LNA; a third conduction path branching from at least one of the first conduction path and the second conduction path and spanning to a ground; and a capacitor inserted into the third conduction path. A second inductance of the second conduction path is greater than a first inductance of a part spanning from the branching point in the first conduction path to the power source terminal.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: September 4, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoichi Sawada
  • Publication number: 20180077790
    Abstract: A high-frequency module includes: a power receiving terminal; an LNA, a reception switch that switches among a plurality of signals in different bands and outputs the signals to the LNA; a first conduction path spanning from the power receiving terminal to a power source terminal of the reception switch; a second conduction path spanning from a branching point in the first conduction path to a power source terminal of the LNA; a third conduction path branching from at least one of the first conduction path and the second conduction path and spanning to a ground; and a capacitor inserted into the third conduction path. A second inductance of the second conduction path is greater than a first inductance of a part spanning from the branching point in the first conduction path to the power source terminal.
    Type: Application
    Filed: September 8, 2017
    Publication date: March 15, 2018
    Inventor: Yoichi Sawada