Abstract: The present invention provides a gas diffusion electrode which is capable of restraining the progression of carbon corrosion at an anode gas diffusion electrode of a fuel cell even in a reverse potential state that is caused by deficiency of a fuel supplied to the anode gas diffusion electrode, and which is therefore free from a decrease in the power generation performance of the cell.

Abstract: Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

Abstract: Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

Abstract: The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).

Abstract: Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

Abstract: The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Abstract: Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability. Means for Solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Abstract: A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.