Abstract: A plating apparatus includes a bath configured to reserve a plating solution for plating a substrate and a holder configured to hold the substrate. The bath includes an anode electrode provided inside the bath. The holder includes a cathode electrode for applying a voltage to the substrate. The bath is equipped with first and second discharge portions. The plating apparatus includes a first path, a supply path, a second path and a flow rate control valve. The first path circulates the plating solution, which is discharged from the first discharge portion, to the bath. The supply path supplies the plating solution, which is provided from the first path, into the bath. The second path provides the plating solution, which is discharged from the second discharge portion after flowing on the anode electrode, to the first path. The flow rate control valve controls a flow rate of the plating solution flowing from the second path to the first path.

Abstract: In a check schedule decision method, after simulating the production line to produce a time-varying number of in-process workpieces in a designated process unit, a check-available time period for the designated process unit is detected based on a comparison of the time-varying number of in-process workpieces to a predetermined level. Further, the production line is simulated under a constraint that the designated process unit is stopped operating during the check-available time period to produce a simulated output of the production line being simulated. When the simulated output is not smaller than a predetermined target figure, a check schedule of the designated process unit is decided within the check-available time period.

Abstract: The invention provides a work supply method and apparatus for a batch process apparatus for semiconductor wafers by which works having a comparatively severe delivery date are processed preferentially. A processing end time calculation section of a batch formation control section refers to a history file in response to a processing start report from a batch process apparatus to predict a processing end time. A work extraction section refers to a step management file to extract those of the works which can arrive at a batch process apparatus on or prior to the thus predicted processing end time. A batch formation section forms, designating the extracted works as an object of batch formation, the works into a batch such that one of the works which has the highest preferential degree is designated as a top work of the batch. A transport section transports the works of the batch collectively to the batch process apparatus.

Abstract: A system for producing a semiconductor wafer includes a production progress comparing/calculating unit, a fabrication device status monitor step, an inventory control step, and a process shelf controller step. In response to a timing signal from the fabrication device status monitor step, the production progress comparing/calculating unit determines a semiconductor wafer to be processed next, and the determined semiconductor wafer is automatically searched for on a process shelf. The fabrication devices of a semiconductor wafer production line start processing semiconductor wafers at suitable times thereby producing semiconductor wafers according to a production plan and meeting a delivery time for the semiconductor wafers.