Patents by Inventor Yoichi Togawa

Yoichi Togawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11365959
    Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: June 21, 2022
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventors: Hitoshi Tamura, Tomotaka Yamagata, Kento Kurihara, Yoichi Togawa
  • Publication number: 20210293519
    Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.
    Type: Application
    Filed: June 2, 2021
    Publication date: September 23, 2021
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventors: Hitoshi TAMURA, Tomotaka YAMAGATA, Kento KURIHARA, Yoichi TOGAWA
  • Patent number: 8936417
    Abstract: To provide a method of controlling a machine tool and a machine tool which allow preventing relieving interference without using a mechanism for causing an offset between a cutter (13) and a workpiece (50), a controller (40) performs control such that the workpiece (50) is machined by repeating the steps of: machining the workpiece (50) by moving the cutter (13) for machining the workpiece (50) in a direction parallel to a rotational axis of the cutter (50) while rotating the workpiece (50) together with the cutter (13); and returning the cutter (13) to a machining start position again after termination of the machining step, and performs offset control such that the cutter (13) is moved away from the workpiece (50) in a rotation direction of the cutter (13) upon the termination of the machining step.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: January 20, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takahide Tokawa, Yoichi Togawa
  • Publication number: 20110262239
    Abstract: To provide a method of controlling a machine tool and a machine tool which allow preventing relieving interference without using a mechanism for causing an offset between a cutter (13) and a workpiece (50), a controller (40) performs control such that the workpiece (50) is machined by repeating the steps of: machining the workpiece (50) by moving the cutter (13) for machining the workpiece (50) in a direction parallel to a rotational axis of the cutter (50) while rotating the workpiece (50) together with the cutter (13); and returning the cutter (13) to a machining start position again after termination of the machining step, and performs offset control such that the cutter (13) is moved away from the workpiece (50) in a rotation direction of the cutter (13) upon the termination of the machining step.
    Type: Application
    Filed: November 13, 2009
    Publication date: October 27, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takahide Tokawa, Yoichi Togawa
  • Patent number: 4695209
    Abstract: The helical guide apparatus includes a main spindle, a male pattern, a first female pattern and a second female pattern which are operatively associated with one another. As the main spindle adapted to reciprocably move in the axial direction and rotate in the circumferential direction is reciprocably driven in the axial direction by first reciprocable driving means, it carries out reciprocable rotational movement in accordance with a lead which is determined by a combination of the first helical projection on the male pattern and the first helical recess on the first female pattern.
    Type: Grant
    Filed: July 21, 1986
    Date of Patent: September 22, 1987
    Assignee: Mitsubishi Jukogyo Kabushiki Kaisha
    Inventors: Takayo Noguchi, Yoichi Togawa, Tsuneo Nishimoto, Yoshiharu Tonohara, Tadashi Rokkaku, Seigo Nakai, Michio Araki, Kahei Kitano