Patents by Inventor Yoichi Usui

Yoichi Usui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200212769
    Abstract: A bar or coil includes a conductor arranged in a rotating electrical machine and an insulating layer having a Predetermined insulation thickness disposed on a surface of the conductor. The repair method includes: extracting a part of the bar or coil as a repair target; removing the insulating layer in a part of the bar or coil as the repair target; disposing a first insulating layer in the part where the insulating layer is removed, the first insulating layer having an insulation thickness thinner than the predetermined insulation thickness; and disposing a second insulating layer on a surface of the first insulating layer to form an insulating layer after a repair where the first insulating layer and the second insulating layer are added, the insulating layer after the repair having a thickness of the predetermined insulation thickness.
    Type: Application
    Filed: December 10, 2019
    Publication date: July 2, 2020
    Applicant: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
    Inventors: Yoichi TANI, Takashi USUI, Seijiro MURAMATSU, Mitsuru ONODA
  • Patent number: 10527927
    Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 ?m×1 ?m of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70?BA30)/(BD70?BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 7, 2020
    Assignee: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Yoichi Usui
  • Publication number: 20190155141
    Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 ?m×1 ?m of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70?BA30)/(BD70?BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 23, 2019
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Yoichi Usui
  • Patent number: 10209614
    Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 ?m×1 ?m of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70-BA30)/(BD70-BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: February 19, 2019
    Assignee: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Yoichi Usui
  • Publication number: 20170315439
    Abstract: A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 ?m×1 ?m of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70-BA30)/(BD70-BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
    Type: Application
    Filed: July 21, 2017
    Publication date: November 2, 2017
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Yoichi USUI
  • Patent number: 9746762
    Abstract: Provided is a conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 ?m×1 ?m of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70?BA30)/(BD70?BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: August 29, 2017
    Assignee: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Yoichi Usui
  • Publication number: 20160124298
    Abstract: Provided is a conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 ?m×1 ?m of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70?BA30)/(BD70?BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
    Type: Application
    Filed: September 22, 2014
    Publication date: May 5, 2016
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Yoichi USUI
  • Patent number: 7722998
    Abstract: A reflective mask and a reflective mask blank that can form a fine mask pattern with high accuracy in shape, achieve a sufficient contrast in a pattern inspection, and enable a pattern transfer with high accuracy. On a substrate (11), a multilayer reflective film (12) for reflecting an exposure light, a buffer layer (13), and an absorber layer for absorbing the exposure light are successively deposited in this order. This absorber layer has a layered structure composed of an uppermost layer (15) and a lower layer (14) other than it. The uppermost layer (15) exhibits a reflectance of 20% or less with respect to a light having an inspection wavelength for use in an inspection of a pattern formed in the absorber layer and further is formed of an inorganic material having a resistance against an etching condition in forming a pattern in the lower layer.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: May 25, 2010
    Assignee: Hoya Corporation
    Inventors: Shinichi Ishibashi, Yoichi Usui
  • Publication number: 20080193862
    Abstract: A reflective mask and a reflective mask blank that can form a fine mask pattern with high accuracy in shape, achieve a sufficient contrast in a pattern inspection, and enable a pattern transfer with high accuracy. On a substrate (11), a multilayer reflective film (12) for reflecting an exposure light, a buffer layer (13), and an absorber layer for absorbing the exposure light are successively deposited in this order. This absorber layer has a layered structure composed of an uppermost layer (15) and a lower layer (14) other than it. The uppermost layer (15) exhibits a reflectance of 20% or less with respect to a light having an inspection wavelength for use in an inspection of a pattern formed in the absorber layer and further is formed of an inorganic material having a resistance against an etching condition in forming a pattern in the lower layer.
    Type: Application
    Filed: January 18, 2008
    Publication date: August 14, 2008
    Inventors: Shinichi ISHIBASHI, Yoichi Usui
  • Patent number: 7348105
    Abstract: A reflective mask and a reflective mask blank that can form a fine mask pattern with high accuracy in shape, achieve a sufficient contrast in a pattern inspection, and enable a pattern transfer with high accuracy. On a substrate (11), a multilayer reflective film (12) for reflecting an exposure light, a buffer layer (13), and an absorber layer for absorbing the exposure light are successively deposited in this order. This absorber layer has a layered structure composed of an uppermost layer (15) and a lower layer (14) other than it. The uppermost layer (15) exhibits a reflectance of 20% or less with respect to a light having an inspection wavelength for use in an inspection of a pattern formed in the absorber layer and further is formed of an inorganic material having a resistance against an etching condition in forming a pattern in the lower layer.
    Type: Grant
    Filed: July 4, 2003
    Date of Patent: March 25, 2008
    Assignee: Hoya Corporation
    Inventors: Shinichi Ishibashi, Yoichi Usui
  • Publication number: 20050238963
    Abstract: A reflective mask and a reflective mask blank that can form a fine mask pattern with high accuracy in shape, achieve a sufficient contrast in a pattern inspection, and enable a pattern transfer with high accuracy. On a substrate (11), a multilayer reflective film (12) for reflecting an exposure light, a buffer layer (13), and an absorber layer for absorbing the exposure light are successively deposited in this order. This absorber layer has a layered structure composed of an uppermost layer (15) and a lower layer (14) other than it. The uppermost layer (15) exhibits a reflectance of 20% or less with respect to a light having an inspection wavelength for use in an inspection of a pattern formed in the absorber layer and further is formed of an inorganic material having a resistance against an etching condition in forming a pattern in the lower layer.
    Type: Application
    Filed: July 4, 2003
    Publication date: October 27, 2005
    Inventors: Shinichi Ishibashi, Yoichi Usui