Patents by Inventor Yoichiro HIRAKAWA

Yoichiro HIRAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11515263
    Abstract: A method of producing a silicon wafer includes: a laser mark printing step of printing a laser mark having a plurality of dots on a silicon wafer; an etching step of performing etching on at least a laser-mark printed region in a surface of the silicon wafer; and a polishing step of performing polishing on both surfaces of the silicon wafer having been subjected to the etching step. In the laser mark printing step, each of the plurality of dots is formed by a first step of irradiating a predetermined position on a periphery of the silicon wafer with laser light of a first beam diameter thereby forming a first portion of the dot and a second step of irradiating the predetermined position with laser light of a second beam diameter that is smaller than the first beam diameter thereby forming a second portion of the dot.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: November 29, 2022
    Assignee: SUMCO CORPORATION
    Inventor: Yoichiro Hirakawa
  • Publication number: 20220331906
    Abstract: Provided is a laser mark printing method and a method of producing a laser-marked silicon wafer that can reduce the machining strain left around dots constituting a laser mark. In a method of printing a laser mark having a plurality of dots on a silicon wafer, the plurality of dots are formed using laser light having a wavelength in the ultraviolet region.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 20, 2022
    Applicant: SUMCO CORPORATION
    Inventor: Yoichiro HIRAKAWA
  • Publication number: 20210375782
    Abstract: A method of producing a silicon wafer includes: a laser mark printing step of printing a laser mark having a plurality of dots on a silicon wafer; an etching step of performing etching on at least a laser-mark printed region in a surface of the silicon wafer; and a polishing step of performing polishing on both surfaces of the silicon wafer having been subjected to the etching step. In the laser mark printing step, each of the plurality of dots is formed by a first step of irradiating a predetermined position on a periphery of the silicon wafer with laser light of a first beam diameter thereby forming a first portion of the dot and a second step of irradiating the predetermined position with laser light of a second beam diameter that is smaller than the first beam diameter thereby forming a second portion of the dot.
    Type: Application
    Filed: September 6, 2019
    Publication date: December 2, 2021
    Applicant: SUMCO Corporation
    Inventor: Yoichiro HIRAKAWA
  • Publication number: 20200103423
    Abstract: Disclosed is a method for obtaining information on subject's diabetes, comprising measuring lipoprotein's ability to uptake sterol in a biological sample of a subject, wherein a measured value of ability to uptake sterol per unit volume of the biological sample is an indicator of diabetes onset risk.
    Type: Application
    Filed: September 25, 2019
    Publication date: April 2, 2020
    Applicants: Kyushu University, National University Corporation, NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY, SYSMEX CORPORATION
    Inventors: Toshiharu NINOMIYA, Yoichiro HIRAKAWA, Ryuji TOH, Yasuhiro IRINO, Katsuhiro MURAKAMI, Keiko MIWA, Amane HARADA