Abstract: A tape sticking apparatus includes a rubber sheet that partitions an airtight space formed above a chamber into first and second airtight spaces and, a tape frame that holds a tape above the rubber sheet, and a supply/exhaust mechanism that switches between pressurizing and depressurizing by supplying gas to or sucking gas from the first and second airtight spaces. The gas supply/exhaust mechanism includes a first flow-rate control valve that controls the flow rate of sucked gas when the first airtight space is depressurized, and a second flow-rate control valve that controls the flow rate of supplied when the first airtight space is pressurized.

Abstract: A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second airtight spaces and has an upper sheet on which a wafer is placed; a tape frame that holds a tape above the rubber sheet; and first and second supply/exhaust tubes that switch pressurization and depressurization of the first and second airtight spaces. In pressurizing the second airtight space and expanding the rubber sheet to lift the wafer to be attached to the tape, after bringing the first and second airtight spaces into a vacuum state, the wafer is attached to the tape while an amount of pressurization of the second airtight space is controlled to change an expansion rate of the rubber sheet from a low speed to a high speed stepwisely.

Abstract: A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second airtight spaces and has an upper sheet on which a wafer is placed; a tape frame that holds a tape above the rubber sheet; and first and second supply/exhaust tubes that switch pressurization and depressurization of the first and second airtight spaces. In pressurizing the second airtight space and expanding the rubber sheet to lift the wafer to be attached to the tape, after bringing the first and second airtight spaces into a vacuum state, the wafer is attached to the tape while an amount of pressurization of the second airtight space is controlled to change an expansion rate of the rubber sheet from a low speed to a high speed stepwisely.

Abstract: A tape sticking apparatus includes a rubber sheet that partitions an airtight space formed above a chamber into first and second airtight spaces and, a tape frame that holds a tape above the rubber sheet, and a supply/exhaust mechanism that switches between pressurizing and depressurizing by supplying gas to or sucking gas from the first and second airtight spaces. The gas supply/exhaust mechanism includes a first flow-rate control valve that controls the flow rate of sucked gas when the first airtight space is depressurized, and a second flow-rate control valve that controls the flow rate of supplied when the first airtight space is pressurized.

Abstract: A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second airtight spaces and has an upper sheet on which a wafer is placed; a tape frame that holds a tape above the rubber sheet; and first and second supply/exhaust tubes that switch pressurization and depressurization of the first and second airtight spaces. In pressurizing the second airtight space and expanding the rubber sheet to lift the wafer to be attached to the tape, after bringing the first and second airtight spaces into a vacuum state, the wafer is attached to the tape while an amount of pressurization of the second airtight space is controlled to change an expansion rate of the rubber sheet from a low speed to a high speed stepwisely.