Abstract: A mounted component inspection apparatus according to the present invention includes: a component library holding inspection information; an inspection processing unit for inspecting a component under inspection using the component library; a match rate acquisition unit for acquiring a match rate indicating the degree to which the inspection information is suitable for the inspection by the inspection processing unit, on the basis of the result of the inspection by the inspection processing unit; and a judgment unit for selecting the inspection information having a higher match rate, of the inspection information before updating and the inspection information after updating. The component library can hold the inspection information before and after updating, and the inspection processing unit carries out the inspection using the inspection information before and after updating held in the component library.

Abstract: The waveform signals of ultrasonic waves reflected by a plurality of interfaces in a measurement object are received, the waveform signal of a reflected wave on a reference interface inside the measurement object is detected based on the amplitudes of the received waveform signals, and evaluation is made on the bonded condition of an interface to be measured based on the waveform signal of the reflected wave on the reference interface.

Abstract: In a comparison between master data created from a waveform signal of an observed object of an acceptable article and a waveform signal obtained from a non-measured observed object, time phase difference generated in the observed object is corrected, and difference with the master data is detected. As a first stage, quality determination is performed on the non-measured observed object with a long interval master data using the created master data, and the time phase difference is corrected. Then, as a second stage, quality determination is performed with the short interval master data divided on a time axis and the similarly divided waveform signal of the observed object. The time phase difference generated between the observed objects (acceptable article and defective article) is thereby corrected, and quality determination of high accuracy can be performed from the comparison with the waveform signal of the acceptable article.

Abstract: An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is separate from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.

Abstract: In a comparison between master data created from a waveform signal of an observed object of an acceptable article and a waveform signal obtained from a non-measured observed object, time phase difference generated in the observed object is corrected, and difference with the master data is detected. As a first stage, quality determination is performed on the non-measured observed object with a long interval master data using the created master data, and the time phase difference is corrected. Then, as a second stage, quality determination is performed with the short interval master data divided on a time axis and the similarly divided waveform signal of the observed object. The time phase difference generated between the observed objects (acceptable article and defective article) is thereby corrected, and quality determination of high accuracy can be performed from the comparison with the waveform signal of the acceptable article.

Abstract: A mounted component inspection apparatus according to the present invention includes: a component library holding inspection information; an inspection processing unit for inspecting a component under inspection using the component library; a match rate acquisition unit for acquiring a match rate indicating the degree to which the inspection information is suitable for the inspection by the inspection processing unit, on the basis of the result of the inspection by the inspection processing unit; and a judgment unit for selecting the inspection information having a higher match rate, of the inspection information before updating and the inspection information after updating. The component library can hold the inspection information before and after updating, and the inspection processing unit carries out the inspection using the inspection information before and after updating held in the component library.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is a separate body from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.

Abstract: The waveform signals of ultrasonic waves reflected by a plurality of interfaces in a measurement object are received, the waveform signal of a reflected wave on a reference interface inside the measurement object is detected based on the amplitudes of the received waveform signals, and evaluation is made on the bonded condition of an interface to be measured based on the waveform signal of the reflected wave on the reference interface.

Abstract: In order to direct a probe having directivity that a received band is widened in accordance with a measurement distance, toward a DUT, shift the received band of the probe in sequence, receive electromagnetic, and measure electromagnetic interference, a plurality of long and short measurement distances between the probe and the DUT are set, and measurement at the long measurement distance and measurement at the short measurement distance are performed plural times. Herein, the measurement at the short measurement distance is performed on a received band where electromagnetic interference is measured by the measurement at the long measurement distance. Thus, measurement of electromagnetic interference can be performed with high accuracy in a short time.

Abstract: Unidirectional light is radiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is radiated onto the bump-formation surface in inclined directions to acquire a second overall image. First bump inspection images are respectively acquired from the first overall image, and second bump inspection images are respectively acquired from the second overall image. Then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Hereby, bump inspection with high precision and efficiency is achieved.

Abstract: A bottom surface of a medium tank 1 is closed with a polymer film 2, the polymer film 2 is stuck to the medium tank 1 by reducing the pressure of the inside of the medium tank 1, an ultrasonic wave transmission medium 5 is injected while reducing the pressure of the inside of the medium tank 1 so that the distal end of an ultrasonic probe 3 is immersed, the inside of the medium tank 1 is pressurized while keeping an inspection object 6 in contact with the polymer film 2, an ultrasonic wave reflected by the inspection object is received by the ultrasonic probe 3.

Abstract: In order to direct a probe having directivity that a received band is widened in accordance with a measurement distance, toward a DUT, shift the received band of the probe in sequence, receive electromagnetic, and measure electromagnetic interference, a plurality of long and short measurement distances between the probe and the DUT are set, and measurement at the long measurement distance and measurement at the short measurement distance are performed plural times. Herein, the measurement at the short measurement distance is performed on a received band where electromagnetic interference is measured by the measurement at the long measurement distance. Thus, measurement of electromagnetic interference can be performed with high accuracy in a short time.

Abstract: In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: Unidirectional light is irradiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is irradiated onto the bump-formation surface in respective inclined directions to acquire a second overall image, first bump inspection images are respectively acquired from the first overall image, second bump inspection images are respectively acquired from the second overall image, then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Herewith, bump inspection with high precision and efficiency is achieved.

Abstract: In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.

Abstract: A purified acid addition salt of a (2S, 3S, 5S)-2,5-diamino-1,6-diphenyl-3-hydroxyhexane, e.g., (2S, 3S, 5S)-2-tert-butoxycarbonylamino-3-hydroxy-5-amino-1,6-diphenylhexane, is obtained from its mixture, in an arbitrary ratio, with its (2S, 3S, 5R) stereoisomer in the presence of an inorganic or organic acid. The desired (2S, 3S, 5S) acid addition salt may be recovered from the mixture by, for example, recrystallization. These purified acid addition salts are useful as intermediates in the synthesis of medicines such as retrovirus protease inhibitors including human immunodeficiency virus (HIV) protease inhibitors.

Abstract: The invention provides methods for preparing a 2-isoxazoline compound represented by formula (1) and a 2,5-diamino-1,6-diphenyl-3-hydroxyhexane compound obtainable by reducing the 2-isoxazoline compound and represented by formula (6): ##STR1## wherein Ph is phenyl; and each of R.sup.1 and R.sup.2 independently represents hydrogen, acyl, alkyloxycarbonyl, arylalkyloxycarbonyl, aryloxycarbonyl, alkylaminocarbonyl, arylalkylaminocarbonyl, arylaminocarbonyl, alkyl, arylalkyl, aryl, alkylsulfonyl, acylalkylsulfonyl, or arylsulfonyl, or R.sup.1 and R.sup.2 are linked to each other to form divalent acyl. These compounds are useful as intermediates in the synthesis of medicines such as retrovirus protease inhibitors including human immunodeficiency virus (HIV) protease inhibitors.

Abstract: The present invention provides useful intermediates for the synthesis of 2,5-diamino-1,6-diphenyl-3-hydroxyhexane derivatives which serve as intermediates in the synthesis of medicines such as retrovirus protease inhibitors including human immunodeficiency virus (HIV) protease inhibitors, and a method for preparing these intermediates using the former intermediates.More particularly, the invention provides methods for preparing a 2-isoxazoline derivative represented by formula ?1! and a 2,5-diamino-1,6-diphenyl-3-hydroxyhexane derivative obtainable by reducing the 2-isoxazoline derivative and represented by formula ?6!: ##STR1## (wherein Ph is phenyl; and each of R.sup.1 and R.sup.2 independently represents hydrogen, acyl, alkyloxycarbonyl, arylalkyloxycarbonyl, aryloxycarbonyl, alkylaminocarbonyl, arylalkylaminocarbonyl, arylaminocarbonyl, alkyl, arylalkyl, aryl, alkylsulfonyl, arylalkylsulfonyl, or arylsulfonyl, or R.sup.1 and R.sup.2 are linked to each other to represent divalent acyl).