Patents by Inventor Yoichiro Yasuda

Yoichiro Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of determining thermal property of substrate and method of deciding heat treatment condition
    Patent number: 8308350
    Abstract: [Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatus 1 comprising lamps 9 for heating a wafer W and temperature sensors T1 to T7 arranged so as to oppose the lamps 9, temperature data sequentially outputted from the temperature sensors T1 to T7 is obtained, while subjecting the wafer W arranged between the lamps 9 and temperature sensors T1 to T7 to pulsed heating with the lamps 9. Thereafter, the thermal property of the wafer W is determined by using the temperature data.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: November 13, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Yoichiro Yasuda, Toshiyuki Tsukamoto, Masamori Sanaka, Hiroshi Asechi, Atsuhiro Ogura
  • Method Of Determining Thermal Property Of Substrate And Method Of Deciding Heat Treatment Condition
    Publication number: 20070291818
    Abstract: [Problem] To provide a method that can determine a thermal property of a substrate in a short time and a method that can determine a thermal process condition of an open-loop step. [Solving Means] In accordance with the substrate thermal property determining method of the present invention in a rapid thermal processing apparatus 1 comprising lamps 9 for heating a wafer W and temperature sensors T1 to T7 arranged so as to oppose the lamps 9, temperature data sequentially outputted from the temperature sensors T1 to T7 is obtained, while subjecting the wafer W arranged between the lamps 9 and temperature sensors T1 to T7 to pulsed heating with the lamps 9. Thereafter, the thermal property of the wafer W is determined by using the temperature data.
    Type: Application
    Filed: August 9, 2005
    Publication date: December 20, 2007
    Applicant: APPLIED MATERIALS INC.
    Inventors: Yoichiro Yasuda, Toshiyuki Tsukamoto, Masamori Sanaka, Hiroshi Asechi, Atsuhiro Ogura