Patents by Inventor Yoji Ishida

Yoji Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240092890
    Abstract: A bispecific antibody including a first domain which specifically binds to a mutant calreticulin protein and a second domain which specifically binds to a CD3 antigen. A pharmaceutical composition including the bispecific antibody or a functional fragment thereof. A diagnostic method for a myeloproliferative neoplasm, including detecting a polypeptide in a biological sample with the bispecific antibody.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 21, 2024
    Applicants: JUNTENDO EDUCATIONAL FOUNDATION, MEIJI SEIKA PHARMA CO., LTD.
    Inventors: Norio KOMATSU, Marito ARAKI, Yoshihiko KIHARA, Yoji ISHIDA, Koichi KITAMURA, Takayoshi FUKUSHIMA, Kaori YASUI
  • Patent number: 7346578
    Abstract: A settlement system is provided for an electronic cashing card such as an IC card, a prepaid card, or the like. A card comprises a memory storing process data to execute a settlement under a condition of matching a personal authentication. Also, a memory stores process data to execute a settlement without matching a personal authentication. When settlement is executed with authentication processing, an authentication balance stored memory is updated to the amount of the balance after the settlement. A non-authentication balance stored in memory is updated to an amount of money equal to or smaller than the authentication balance. When executing a settlement, the non-authentication balance is compared with the authentication balance. It is determined that an illegal process has been executed with the card when the non-authentication balance is larger than the authentication balance.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: March 18, 2008
    Assignee: Fujitsu Limited
    Inventors: Yoji Ishida, Tohru Karashima
  • Patent number: 4202709
    Abstract: A method for manufacturing an aluminum or aluminum alloy clad steel sheet in an easy, economical manner. An aluminized steel sheet obtained by applying aluminum or an aluminum alloy to a steel sheet by hot dipping is heated to a temperature between 100.degree. and 550.degree. C. Then, an aluminum or aluminum alloy sheet having its bonding face cleaned and having room temperature is superposed on one side or each of two sides of the aluminized steel sheet. The superposed sheets are rolled together to a draft reduction percentage of 10 to 40% to roll bond the aluminum or aluminum alloy sheet or sheets with the aluminized steel sheet. Then, if desired, the roll bonded sheets are further subjected to either one or both of finish rolling and/or a softening treatment. An aluminum or aluminum alloy clad steel sheet thus obtained has excellent strength, corrosion resistance and bending formability.
    Type: Grant
    Filed: March 12, 1979
    Date of Patent: May 13, 1980
    Assignee: Furukawa Aluminum Co., Ltd.
    Inventors: Seiji Shibamori, Yoji Ishida
  • Patent number: D258286
    Type: Grant
    Filed: March 2, 1979
    Date of Patent: February 17, 1981
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoji Ishida, Minoru Hashimoto, Yoshiyuki Nomura, Yoshiaki Inoue