Abstract: A conveying system includes a first belt conveyor; a second belt conveyor; a workpiece guide that includes guide paths that receive workpieces that have fallen from a downstream end portion of the first belt conveyor one by one and then guide the workpieces to an upstream end portion of the second belt conveyor; a rotary mechanism that displaces the downstream end portion along a substantially arc-shaped trajectory to distribute the workpieces that have fallen from the downstream end portion into the guide paths; a first sensor that detects first information that represents that one of the workpieces has fallen from the downstream end portion; and a controlling device that controls an operation of the rotary mechanism. The controlling device controls the rotary mechanism by transmitting an operation command to the displacement mechanism to intermittently displace the downstream end portion by a predetermined distance in response to first information.

Abstract: A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

Abstract: A conveying apparatus includes first, second, and third conveying sections, and a controller. The first and second conveying sections include first and second conveying mechanisms configured to convey workpieces at first and second speeds, respectively. The third conveying section includes a third conveying mechanism, a rotation mechanism, and a first sensor. The third conveying mechanism is in a form of a slide and positioned between the first and second conveying mechanisms. The third conveying mechanism is configured to allow the workpieces dropped thereon from the first conveying mechanism to slide to be transferred onto the second conveying mechanism. The rotation mechanism is configured to turn the third conveying mechanism about a rotation shaft. The first sensor is configured to detect first information indicating that the workpieces have passed the second end portion of the third conveying mechanism. The controller is coupled to the first sensor and the rotation mechanism.

Abstract: A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes a terminal body and a plated film that is located on a surface of the terminal body. In addition, each of the pair of metal terminals includes a terminal bonding portion, a mounting portion, and an extension portion that is provided between the terminal bonding portions and the mounting portion. A plating-removal portion from which the plated film is removed is provided at least at a peripheral surface of the mounting portion, and thus a surface of the terminal body is exposed.

Abstract: A conveying apparatus includes first, second, and third conveying sections, and a controller. The first and second conveying sections include first and second conveying mechanisms configured to convey workpieces at first and second speeds, respectively. The third conveying section includes a third conveying mechanism, a rotation mechanism, and a first sensor. The third conveying mechanism is in a form of a slide and positioned between the first and second conveying mechanisms. The third conveying mechanism is configured to allow the workpieces dropped thereon from the first conveying mechanism to slide to be transferred onto the second conveying mechanism. The rotation mechanism is configured to turn the third conveying mechanism about a rotation shaft. The first sensor is configured to detect first information indicating that the workpieces have passed the second end portion of the third conveying mechanism. The controller is coupled to the first sensor and the rotation mechanism.

Abstract: A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.

Abstract: A conveying system includes a first belt conveyor; a second belt conveyor; a workpiece guide that includes guide paths that receive workpieces that have fallen from a downstream end portion of the first belt conveyor one by one and then guide the workpieces to an upstream end portion of the second belt conveyor; a rotary mechanism that displaces the downstream end portion along a substantially arc-shaped trajectory to distribute the workpieces that have fallen from the downstream end portion into the guide paths; a first sensor that detects first information that represents that one of the workpieces has fallen from the downstream end portion; and a controlling device that controls an operation of the rotary mechanism. The controlling device controls the rotary mechanism by transmitting an operation command to the displacement mechanism to intermittently displace the downstream end portion by a predetermined distance in response to first information.

Abstract: A ceramic electronic component includes an electronic component body and first and second metal terminals. The electronic component body includes a bare ceramic body and first and second outer electrodes. The first and second outer electrodes of the electronic component body are connected respectively to the first and second metal terminals by solders containing Sn as a main constituent. An alloy layer containing Ni—Sn is provided in at least a portion of a bonding interface between adjacent two of the first and second metal terminals and the first and second outer electrodes.

Abstract: A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes a terminal body and a plated film that is located on a surface of the terminal body. In addition, each of the pair of metal terminals includes a terminal bonding portion, a mounting portion, and an extension portion that is provided between the terminal bonding portions and the mounting portion. A plating-removal portion from which the plated film is removed is provided at least at a peripheral surface of the mounting portion, and thus a surface of the terminal body is exposed.

Abstract: A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.

Abstract: A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.

Abstract: A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

Abstract: A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

Abstract: A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.