Patents by Inventor Yoji Kawahara

Yoji Kawahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240353270
    Abstract: A temperature measuring device includes a heat pipe having a container in which a working fluid is enclosed, a temperature sensor that detects a temperature of the heat pipe, and a wire portion connected to the temperature sensor, in which the heat pipe receives heat from a plurality of heat sources.
    Type: Application
    Filed: March 22, 2022
    Publication date: October 24, 2024
    Applicant: Fujikura Ltd.
    Inventors: Randeep Singh, Akihiro Takamiya, Yoji Kawahara, Tsuyoshi Ogawa, Hiromichi Tanaka
  • Publication number: 20240271841
    Abstract: A cold plate includes a main body in contact with a heat source. The main body has: an inflow hole through which a refrigerant flows in; an outflow hole through which the refrigerant flows out; and an internal space communicating with the inflow hole and the outflow hole and through which the refrigerant flows, and includes: a first heat exchange layer in the internal space; and a second heat exchange layer in the internal space. The first heat exchange layer and the second heat exchange layer are laminated in a thickness direction of the first heat exchange layer and of the second heat exchange layer.
    Type: Application
    Filed: February 13, 2024
    Publication date: August 15, 2024
    Applicant: Fujikura Ltd.
    Inventors: Masahiro Matsuda, Yoji Kawahara
  • Publication number: 20240266088
    Abstract: A power supply cable includes a heat pipe including a container and an insulating layer formed on an outer periphery of the container, and a plurality of power lines disposed radially outside the heat pipe and including conductive wires.
    Type: Application
    Filed: February 3, 2022
    Publication date: August 8, 2024
    Applicant: Fujikura Ltd.
    Inventors: Randeep Singh, Akihiro Takamiya, Yoji Kawahara, Tsuyoshi Ogawa, Ichiro Terunuma, Takahiro Suga
  • Publication number: 20240200888
    Abstract: A cold plate includes a housing, which in turn includes a metal base plate and a resin cover. The metal base plate includes: a base part; and a heat exchange part that transfers heat absorbed from a heating element to a refrigerant. The resin cover includes an outer wall part joined to the base part. The housing has: an internal space, surrounded by the base part and the outer wall part, in which the heat exchange part is disposed; an inflow hole that communicates with the internal space and into which the refrigerant flows; and an outflow hole that communicates with the internal space and through which the refrigerant flows out.
    Type: Application
    Filed: December 13, 2023
    Publication date: June 20, 2024
    Applicant: Fujikura Ltd.
    Inventors: Masahiro Matsuda, Yoji Kawahara
  • Publication number: 20240121912
    Abstract: A cold plate includes: a metal base plate having a first surface, a second surface on a side opposite the first surface, and fins disposed in parallel on the first surface; and a topped cylindrical resin cover covering the fins. The first surface has a recessed portion recessed toward the second surface. The topped cylindrical resin cover is heat-fused to the metal base plate on an inner surface of the recessed portion.
    Type: Application
    Filed: January 21, 2022
    Publication date: April 11, 2024
    Applicant: Fujikura Ltd.
    Inventors: Masahiro Matsuda, Koichi Mashiko, Yoji Kawahara
  • Publication number: 20230366634
    Abstract: A heat pipe includes a flat container having an internal space in which a working fluid is sealed and a flat surface facing the internal space, and a wick disposed in the internal space. The wick includes a first wick having a plurality of first voids and a second wick having a plurality of second voids. The first wick rises from the flat surface and is fixed to the flat surface. The second wick is formed of a sintered body of powders and covers a surface of the first wick. Each of the plurality of second voids is smaller on average than each of the plurality of first voids.
    Type: Application
    Filed: June 23, 2021
    Publication date: November 16, 2023
    Applicant: Fujikura Ltd.
    Inventors: Mohammad Shahed Ahamed, Harutoshi Hagino, Akihiro Takamiya, Yoji Kawahara, Tsuyoshi Ogawa
  • Patent number: 5151255
    Abstract: A method for forming a dihydride rich amorphous silicon semiconductor film suitable for use as a window material of solar cells only from a silicon material, which comprises decomposing a gaseous mixture composed of disilane, a dopant capable of imparting p-type electrical conductivity and a diluent gas by applying a glow discharge energy, and thereby forming a semiconductor film having an optical band gap of at least 1.8 eV, preferably more than 1.9 eV, on a substrate.
    Type: Grant
    Filed: October 3, 1990
    Date of Patent: September 29, 1992
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Nobuhiro Fukuda, Sadao Kobayashi, Kenji Miyachi, Hidemi Takenouchi, Yoji Kawahara, Takayuki Teramoto