Patents by Inventor Yoji Kawakami

Yoji Kawakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for forming ball bumps
    Patent number: 5857610
    Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.
    Type: Grant
    Filed: April 28, 1997
    Date of Patent: January 12, 1999
    Assignee: Nippon Steel Corporation
    Inventors: Hiroshi Hoshiba, Kohei Tatsumi, Masashi Konda, Yoji Kawakami
  • Process and apparatus for forming ball bumps
    Patent number: 5803339
    Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.
    Type: Grant
    Filed: April 28, 1997
    Date of Patent: September 8, 1998
    Assignee: Nippon Steel Corporation
    Inventors: Hiroshi Hoshiba, Kohei Tatsumi, Masashi Konda, Yoji Kawakami
  • Process and apparatus for forming ball bumps
    Patent number: 5687901
    Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: November 18, 1997
    Assignee: Nippon Steel Corporation
    Inventors: Hiroshi Hoshiba, Kohei Tatsumi, Masashi Konda, Yoji Kawakami