Patents by Inventor Yoji Kitamura

Yoji Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150017072
    Abstract: Inorganic fibers include a surface and a structure. The surface has a friction coefficient of about 0.5 or greater. The friction coefficient is measured using a scanning probe microscope. The structure is to constitute a holding sealing material to be provided in an exhaust gas purifying apparatus.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Akihito NISHI, Yoji KITAMURA
  • Patent number: 7886955
    Abstract: A solder ball mounting device that can mount minute solder balls with a diameter of 200 ?m or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of openings corresponding to electrodes of a printed circuit board. The device includes a cylindrical member, which is positioned above the mask for arraying solder balls, for gathering solder balls immediately below the openings by sucking in air from the openings. A movement mechanism is for moving the cylindrical member horizontally relative to the mask for arraying solder balls, wherein solder balls gathered on the mask for arraying solder balls are moved by moving the cylindrical member and are then dropped on electrodes of the printed circuit board via openings of the mask for arraying solder balls.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: February 15, 2011
    Assignee: Ibiden Co., Ltd.
    Inventor: Yoji Kitamura
  • Publication number: 20100224397
    Abstract: A wiring board has a substrate with an opening section, an electronic component having an electrode and arranged in the opening section, insulative material filled in the gaps between the substrate and the electronic component in the opening section, and a first conductive layer formed on the insulative material and including a first conductive pattern. A via hole is formed in the insulative material. The electrode of the electronic component and the first conductive pattern are connected by means of the via hole. The height of the via hole is set in the range of 5-15 ?m and the aspect ratio of the via hole is set in the range of 0.07-0.33.
    Type: Application
    Filed: July 7, 2009
    Publication date: September 9, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Keisuke Shimizu, Yoichiro Kawamura, Yoji Kitamura
  • Publication number: 20090120996
    Abstract: A solder ball mounting device that can mount minute solder balls with a diameter of 200 ?m or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of openings corresponding to electrodes of a printed circuit board. The device includes a cylindrical member, which is positioned above the mask for arraying solder balls, for gathering solder balls immediately below the openings by sucking in air from the openings. A movement mechanism is for moving the cylindrical member horizontally relative to the mask for arraying solder balls, wherein solder balls gathered on the mask for arraying solder balls are moved by moving the cylindrical member and are then dropped on electrodes of the printed circuit board via openings of the mask for arraying solder balls.
    Type: Application
    Filed: November 3, 2008
    Publication date: May 14, 2009
    Applicant: IBIDEN CO., LTD.
    Inventor: Yoji KITAMURA
  • Patent number: 5293667
    Abstract: A clearer device for removing accumulated debris on a draft roller has a clearer pad member mounted in a support frame which pivots so as to permit the clearer pad member to come into and out of contact with the draft roller thereby allowing accumulated wastes to escape. A stopper plate is biased against the draft roller by the clearer pad member thus keeping the clearer pad member in contact with the draft roller. An elastic member protrudes from the support frame and contacts a rotating shaft which has a protrusion. The protrusion periodically engages the elastic member which pivots the support frame disengaging the clearer pad member from the draft roller and releasing accumulated wastes.
    Type: Grant
    Filed: July 7, 1992
    Date of Patent: March 15, 1994
    Inventor: Yoji Kitamura
  • Patent number: 4919363
    Abstract: A bobbin hanger enabling the use of a mechanical bobbin changing apparatus. The bobbin hanger is constructed so as to provide an allowance for the movement of a weight for controlling a bobbin holding mechanism in the range of 4 to 10 mm so that the mechanical bobbin changing apparatus is able to achieve bobbin hanging and bobbin removing operations without fail. The bobbin hanger employs bobbin holding fingers formed in a shape which will not allow the bobbin holding fingers to be retracted easily into a bobbin hanging tube by a horizontal force acting on the bobbin holding fingers so that the accidental removal of the bobbin hung on the bobbin hanger is prevented.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: April 24, 1990
    Inventor: Yoji Kitamura