Patents by Inventor Yoji Murakami

Yoji Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5618621
    Abstract: A biaxially oriented laminated polyester film comprising (A) a first layer formed from a first copolyester which is composed of ethylene terephthalate unit as a main recurring unit, and (B) a second layer formed from a polyester composition containing (B1) a second copolyester which is composed of ethylene terephthalate unit as a main recurring unit and (B2) a third (co)polyester which is composed of butylene terephthalate unit as a main recurring unit and is contained in an amount of 1 to 40% by weight or (B3) a filler having an average particle diameter of 2.5 .mu.m or less and is contained in an amount of 5 to 80% by weight in place of the third (co)polyester (B3), the second layer being to constitute a surface to be bonded onto a metal surface when the laminated film is laminated on the metal sheet. This composition can give metal cans, e.g.
    Type: Grant
    Filed: May 30, 1995
    Date of Patent: April 8, 1997
    Assignee: Teijin Limited
    Inventors: Kinji Hasegawa, Takeo Asai, Mitsumasa Ono, Yoji Murakami
  • Patent number: 5610080
    Abstract: A semiconductor device includes a semiconductor device body, a ring part, and connecting parts. The semiconductor device body includes a resin package and a plurality of leads extending outwardly from the resin package. The ring part is made of a resin and surrounds the semiconductor device body. The connecting parts are made of a resin and connect the semiconductor device body and the ring part, so that the semiconductor device body is supported by the ring part via the connecting parts.
    Type: Grant
    Filed: September 11, 1995
    Date of Patent: March 11, 1997
    Assignee: Fujitsu Ltd.
    Inventor: Yoji Murakami
  • Patent number: 5473004
    Abstract: A biaxially oriented polyester film comprising a copolyester which contains a lubricant having an average particle diameter of no greater than 2.5 .mu.m and has a melting point of from 210.degree. to 245.degree. C., the film having a plane orientation coefficient of from 0.10 to 0.16, a thermal shrinkage at 150.degree. C. of no higher than 10%, and a density of lower than 1.385 g/cm.sup.3, and optionally a refractive index in a direction of thickness of from 1.495 to 1.530 as well as a film plane refractive index of from 1.61 to 1.66 in all directions.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: December 5, 1995
    Assignee: Teijin Limited
    Inventors: Tadashi Ono, Kinji Hasegawa, Takeo Asai, Yoji Murakami
  • Patent number: 5473199
    Abstract: A semiconductor device includes a semiconductor device body, a ring part, and connecting parts. The semiconductor device body includes a resin package and a plurality of leads extending outwardly from the resin package. The ring part is made of a resin and surrounds the semiconductor device body. The connecting parts are made of a resin and connect the semiconductor device body and the ring part, so that the semiconductor device body is supported by the ring part via the connecting parts.
    Type: Grant
    Filed: February 24, 1993
    Date of Patent: December 5, 1995
    Assignee: Fujitsu Limited
    Inventor: Yoji Murakami
  • Patent number: 5384354
    Abstract: The present invention provides a polyester film for processing of a metal sheet, which shows excellent molding-processability when it is laminated onto a metal sheet and the laminated metal sheet is made into a can by deep drawing or the like and which is suitable and useful for production of a metal can having excellent heat resistance, impact resistance and flavor-retaining property.A polyester film used for lamination onto a metal sheet for processing of said metal sheet, characterized in that the film is formed from 99 to 60% by weight of a copolyester, as the component A, having an ethylene terephthalate unit as the main recurring unit and having a melting point of 210 to 245.degree. C. and 1 to 40% by weight of a polybutylene terephthalate or a copolyester, as the component B, having a butylene terephthalate unit as the main recurring unit and having a melting point of 180 to 223.degree. C., and further comprising a lubricant having an average particle diameter of 2.5 .mu.
    Type: Grant
    Filed: September 15, 1993
    Date of Patent: January 24, 1995
    Assignee: Teijin Limited
    Inventors: Kinji Hasegawa, Takeo Asai, Yoji Murakami
  • Patent number: 5372867
    Abstract: A polyester film for metal sheet lamination processing which comprises a co-polyester containing a lubricant having an average particle diameter of 2.5 .mu.m or less and the co-polyester having a melting point of 210.degree. to 245.degree. C.; and wherein the refractive index in the direction of film thickness is 1.505 to 1.550, the refractive index in the direction of the film plane is 1.61 to 1.66 about all directions, subpeak by DSC is 150.degree. to 205.degree. C., and optionally, protrusions on the film surface satisfy the formula0.1.ltoreq.Nd/N.ltoreq.0.5wherein N is the number of all the protrusions on the film surface and Nd is the number of the protrusions each containing the lubricant as its nucleus and having a sunk hollow around it.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: December 13, 1994
    Assignee: Teijin Limited
    Inventors: Kinji Hasegawa, Tadashi Ono, Takeo Asai, Yoji Murakami
  • Patent number: 5240779
    Abstract: A biaxially oriented polyester film comprising a copolyester which contains a lubricant having an average particle diameter of no greater than 2.5 .mu.m and has a melting point of from 210.degree. to 245.degree. C., the film having a plane orientation coefficient of from 0.10 to 0.16, a thermal shrinkage at 150.degree. C. of no higher than 10%, and a density of lower than 1.385 g/cm.sup.3, and optionally a refractive index in a direction of thickness of from 1.495 to 1.530 as well as a film plane refractive index of from 1.61 to 1.66 in all directions.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: August 31, 1993
    Assignee: Teijin Limited
    Inventors: Tadashi Ono, Kinji Hasegawa, Takeo Asai, Yoji Murakami
  • Patent number: 5094982
    Abstract: A lead frame includes an outside frame portion having an central opening, and a rectangular mount portion supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array disposed along a side of the mount portion, respectively, the lead elements included in the array being connected to each other by a common tie bar element, and at least two expandable tie bar elements extending between the outside frame portion and each of the lead element arrays to support each lead element array by the outside frame portion, each of the expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolytic-plating process thereof.
    Type: Grant
    Filed: October 3, 1990
    Date of Patent: March 10, 1992
    Assignee: Fujitsu Limited
    Inventors: Toshiaki Suzuki, Yoji Murakami, Masao Kobayashi, Osamu Yamauchi
  • Patent number: 5077118
    Abstract: A stamping foil comprising:(a) a biaxially oriented polyester film containing as a first component from 0.01 to 0.5% by weight of spherical silica particles having an average particle diameter of from 0.03 .mu.m and smaller 0.3 .mu.m and a particle diameter ratio defined as a ratio of long diameter/short diameter of from 1.0 to 1.2, and as a second component from 0.002 to 0.2% by weight of spherical silica particles having an average particle diameter of from 0.6 to 3 .mu.m and a particle diameter ratio defined as a ratio of long diameter/short diameter of from 1.0 to 1.2, provided that the content of said second component is the same as or less than the content of said first component,(b) a release layer provided on one surface of said biaxially oriented polyester film (a), and(c) a cover layer provided on siad release layer (b).
    Type: Grant
    Filed: September 7, 1990
    Date of Patent: December 31, 1991
    Assignee: Teijin Limited
    Inventors: Kinji Hasegawa, Yuzuru Izumi, Yoji Murakami
  • Patent number: 5069944
    Abstract: A thermal transfer record sheet comprising a substrate sheet and a dye receptive layer and a non-tacky layer in this order on at least one surface of the substrate sheet; the dye receptive layer being composed of a crosslinking reaction product of a composition comprising (A-1) a saturated polyester containing units derived from 2,2-bis(4-hydroxyphenyl)propane in the main chain of the polyester and having a glass transition temperature of at least 60.degree. C. and (A-2) a polyisocyanate compound, and the non-tacky layer (B-1) comprising a water-insoluble or sparingly water-soluble fluorine-containing surface-active agent and (B-2) having a thickness of 50 to 200 angstrom.
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: December 3, 1991
    Assignee: Teijin Limited
    Inventors: Takashi Yamagishi, Yukito Yamamoto, Yoji Murakami
  • Patent number: 4977442
    Abstract: A lead frame includes an outside frame portion having an central opening, and a rectangular mount portion supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array disposed along a side of the mount portion, respectively, the lead elements included in the array being connected to each other by a common tie bar element, and at least two expandable tie bar elements extending between the outside frame portion and each of the lead element arrays to support each lead element array by the outside frame portion, each of the expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolytic-plating process thereof.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: December 11, 1990
    Assignee: Fujitsu Limited
    Inventors: Toshiaki Suzuki, Yoji Murakami, Masao Kobayashi, Osamu Yamauchi
  • Patent number: 4937224
    Abstract: A thermal transfer record sheet comprising a substrate sheet and a dye receptive layer and a non-tacky layer in this order on at least one surface of the substrate sheet; the dye receptive layer being composed of a crosslinking reaction product of a composition comprising (A-1) a saturated polyester containing units derived from 2,2-bis(4-hydroxyphenyl)propane in the main chain of the polyester and having a glass transition temperature of at least 60.degree. C. and (A-2) a polyisocyanate compound, and the non-tacky layer (B-1) comprising a water-insoluble or sparingly water-soluble fluorine-containing surface-active agent and (B-2) having a thickness of 50 to 200 angstrom.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: June 26, 1990
    Assignee: Teijin Limited
    Inventors: Takashi Yamagishi, Yukito Yamamoto, Yoji Murakami
  • Patent number: 4900485
    Abstract: A transfer molding method and apparatus in which the internal pressure of a thermosetting resin in a mold is directly detected and is controlled constantly during the transfer molding.
    Type: Grant
    Filed: July 21, 1988
    Date of Patent: February 13, 1990
    Assignee: Fujitsu Limited
    Inventor: Yoji Murakami