Abstract: Methods for removing adhesive from a photomask after a pellicle has been removed from the photomask are herein disclosed. In some embodiments, after a pellicle is removed from a photomask, adhesive residue remaining on the photomask is subjected to removal by an energy source, such as an excimer laser. The excimer laser may be in close proximity to a surface of the photomask which contains the adhesive residue. In some embodiments, removal of the photomask may be followed by a physical cleaning process such as megasonic cleaning or jet nozzle cleaning to remove any residual adhesive left behind.

Abstract: A wafer support apparatus (14) of the present invention comprises a wafer support body (22) having a support area (26) for supporting a wafer W, in an upper surface thereof; and a plurality of lift members (36), each extending from the outside of the support area to the inside of the support area of the wafer support body, having a slope surface sloping downward toward the inside, in an upper surface, and being vertically movable between a lower position and an upper position with respect to the upper surface of the wafer support body.

Abstract: The wafer supporting device of the present invention comprises a wafer support, disposed within a process chamber in a semiconductor manufacturing apparatus having respective heat sources in upper and lower portions thereof; a lift member extending from the outside of the support area of the wafer support to the inside and having an inclined upper surface; an arc-shaped lift ring for supporting the lift member; and a lift pin, adapted to vertically move through a through hole in the wafer support, having an upper end part connected to the lift ring; wherein the through hole is covered and substantially closed with the lift ring when the lift pin descends. This eliminates the unevenness in temperature distribution caused by the through hole.