Patents by Inventor Yoji Ueda
Yoji Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240135815Abstract: A control device includes an outside recognition unit, a parking control unit, and a registration processing unit. When the user selects the parking position, the registration processing unit is configured to detect feature points of the parking position, start a registration process of registering the parking position as the designated parking position, including a verification process for the feature points when the feature point is acquirable, inquire of the user whether a registration for the designated parking position is needed after starting of the verification process, and register the parking position as the designated parking position based on a reply to whether the registration is needed received from the user.Type: ApplicationFiled: October 19, 2023Publication date: April 25, 2024Inventors: Hiroyuki Nakashima, Yoji Inui, Koki Ueda, Kazutaka Hayakawa
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Publication number: 20240087916Abstract: A vacuum processing apparatus includes a decompressable process container; a supply port configured to supply, to the process container, an ionic liquid that absorbs an oxidizing gas; and a discharge port configured to discharge the ionic liquid supplied to the process container. A recess is provided at a joint portion between members constituting the process container. The supply port is configured to supply the ionic liquid to the recess, and the discharge port is configured to discharge the ionic liquid supplied to the recess.Type: ApplicationFiled: November 1, 2023Publication date: March 14, 2024Inventors: Hirokazu UEDA, Yoji IIZUKA, Mitsuaki IWASHITA, Antonio ROTONDARO, Dipak ARYAL, Takeo NAKANO, Ryuichi ASAKO, Kenji SEKIGUCHI, Koji AKIYAMA, Naoki UMESHITA, Takashi HAYAKAWA
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Publication number: 20220396826Abstract: A method reduces variation of measured data when nucleic acid is separated from a very small amount of sample followed by detection of the nucleic acid, wherein the reduction of the variation is achieved by removing contaminant nucleic acid in a nucleic acid purification column. The method of separating the nucleic acid from the sample containing the nucleic acid includes bringing the sample containing the target nucleic acid into contact with a nucleic acid-binding solid-phase carrier capable of adsorbing the nucleic acid; and eluting the nucleic acid from the nucleic acid-binding solid-phase carrier to which the nucleic acid is adsorbed.Type: ApplicationFiled: November 19, 2020Publication date: December 15, 2022Inventors: Yoji Ueda, Emi Shimokawa
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Publication number: 20220033874Abstract: A method evaluates a quality of a dephosphorylation reagent, the method including the steps of: providing a dephosphorylation reagent containing an alkaline phosphatase and a peptide fragment derived from the alkaline phosphatase; and evaluating the dephosphorylation reagent as having a high quality if a content ratio of the peptide fragment to the alkaline phosphatase is a predetermined reference value or less.Type: ApplicationFiled: September 25, 2019Publication date: February 3, 2022Inventors: Masateru Ito, Yoji Ueda, Yuki Takii, Mai Yagi
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Publication number: 20210395708Abstract: A composition contains an alkaline phosphatase and first to sixth peptide fragments, wherein content ratios of the first to sixth peptide fragments to the alkaline phosphatase satisfy formulas (1) to (6), respectively: (X1/Y)×100?0.6000 (1); (X2/Y)×100?0.1800 (2); (X3/Y)×100?0.2000 (3); (X4/Y)×100?0.8000 (4); (X5/Y)×100?1.6000 (5); and (X6/Y)×100?0.3500 (6), wherein X1 to X6 represent peak area values of the first to sixth peptide fragments calculated by an automatic integration method from an extracted ion chromatogram obtained by an LC-MS/MS analysis of the composition, respectively, and Y represents a peak area value of the alkaline phosphatase calculated by an automatic integration method from a chromatogram obtained by an LC-UV analysis of the composition.Type: ApplicationFiled: September 25, 2019Publication date: December 23, 2021Inventors: Masateru Ito, Yoji Ueda, Yuki Takii, Mai Yagi
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Publication number: 20210332337Abstract: A composition contains an alkaline phosphatase; and a peptide fragment group (A) composed of two or more peptide fragments, wherein each of the two or more peptide fragments consists of 5 to 50 consecutive amino acid residues selected from positions 501 to 578 of the amino acid sequence set forth in SEQ ID NO: 5, wherein a content ratio of the peptide fragment group (A) to the alkaline phosphatase satisfies formula (A): (XA/Y)×100?4.4000 (A), wherein XA represents a peak area value of the peptide fragment group (A) calculated by an automatic integration method from an extracted ion chromatogram obtained by an LC-MS/MS analysis of the composition, and Y represents a peak area value of the alkaline phosphatase calculated by an automatic integration method from a chromatogram obtained by an LC-UV analysis of the composition.Type: ApplicationFiled: September 25, 2019Publication date: October 28, 2021Inventors: Yoji Ueda, Yuki Takii, Masateru Ito, Mai Yagi
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Patent number: 10676783Abstract: An analysis chip includes a substrate main body having a plurality of reaction portions in which a selective binding substance selectively binding to a substance to be examined is immobilized; a corner portion in which different straight lines or curved lines intersect with each other in a cross section in which a plane passing through a surface of the substrate main body on which the reaction portions are provided is a cut surface; a partition portion formed by applying water repellent treatment to the surface of the substrate main body on which the reaction portions are provided, the partition portion being configured to partition the reaction portions inside an outer edge formed by the surface, and a connection portion having water repellency, the connection portion being configured to connect between a part of the partition portion and the corner portion.Type: GrantFiled: March 31, 2016Date of Patent: June 9, 2020Assignee: Toray Industries, Inc.Inventors: Hiroki Otsuka, Yoji Ueda
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Patent number: 10642196Abstract: A cleaning device has a housing where an opening and a toner storage portion are formed, a cleaning member arranged in the opening, a collection roller collecting toner attached to the cleaning member, a blade scraping off toner attached to the collection roller, a sheet member dividing between the toner storage portion and the opening, and a sealing member arranged to be in contact with the housing and both end parts of the outer circumferential surface of the collection roller in the axial direction. A first region having a predetermined surface roughness is formed in a middle part of the circumferential surface of the collection roller in the axial direction, and a second region having a lower surface roughness than the first region is formed next to both end parts of the first region in the axial direction.Type: GrantFiled: June 25, 2019Date of Patent: May 5, 2020Assignee: KYOCERA Document Solutions Inc.Inventors: Yoji Ueda, Yuji Kamiyama
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Publication number: 20200057403Abstract: A cleaning device has a housing where an opening and a toner storage portion are formed, a cleaning member arranged in the opening, a collection roller collecting toner attached to the cleaning member, a blade scraping off toner attached to the collection roller, a sheet member dividing between the toner storage portion and the opening, and a sealing member arranged to be in contact with the housing and both end parts of the outer circumferential surface of the collection roller in the axial direction. A first region having a predetermined surface roughness is formed in a middle part of the circumferential surface of the collection roller in the axial direction, and a second region having a lower surface roughness than the first region is formed next to both end parts of the first region in the axial direction.Type: ApplicationFiled: June 25, 2019Publication date: February 20, 2020Applicant: KYOCERA Document Solutions Inc.Inventors: Yoji UEDA, Yuji KAMIYAMA
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Patent number: 10443085Abstract: Disclosed is a method for detecting a nucleic acid using a substance that suppresses, in the labeling step of the post-staining method, detachment of a target nucleic acid that has once hybridized with a capture probe immobilized on a support, which method enables detection of the target nucleic acid with a sensitivity equivalent to or higher than that achieved by a method using sodium ion even in cases where the substance is used at a lower concentration. The method for detecting a nucleic acid comprises the steps of: (1) hybridizing a capture probe with a target nucleic acid to form a double-stranded nucleic acid; bringing the formed double-stranded nucleic acid into contact with a solution containing a labeling substance and a divalent metal cation at a concentration of not less than 10 mM to introduce the labeling substance into the double-stranded nucleic acid; and detecting the labeling substance introduced into the double-stranded nucleic acid.Type: GrantFiled: June 19, 2013Date of Patent: October 15, 2019Assignee: TORAY INDUSTRIES, INC.Inventors: Fumio Nakamura, Yoji Ueda, Takafumi Arike
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Publication number: 20180087100Abstract: An analysis chip includes a substrate main body having a plurality of reaction portions in which a selective binding substance selectively binding to a substance to be examined is immobilized; a corner portion in which different straight lines or curved lines intersect with each other in a cross section in which a plane passing through a surface of the substrate main body on which the reaction portions are provided is a cut surface; a partition portion formed by applying water repellent treatment to the surface of the substrate main body on which the reaction portions are provided, the partition portion being configured to partition the reaction portions inside an outer edge formed by the surface, and a connection portion having water repellency, the connection portion being configured to connect between a part of the partition potion and the corner portion.Type: ApplicationFiled: March 31, 2016Publication date: March 29, 2018Inventors: Hiroki Otsuka, Yoji Ueda
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Patent number: 9416403Abstract: A method of detecting a target nucleic acid by sandwich hybridization using a detection probe that hybridizes with the target nucleic acid, and a capture probe immobilized on a support wherein at least one nucleic acid base in the nucleic acid molecule(s) of the detection probe and/or capture probe with a photoreactive group includes irradiating, with light, a complex formed by hybridization between the target nucleic acid and the detection probe and/or capture probe to allow formation of a covalent bond(s) between the photoreactive group(s) and a nucleic acid base(s) in the target nucleic acid.Type: GrantFiled: August 29, 2013Date of Patent: August 16, 2016Assignee: Toray Industries, Inc.Inventors: Taisuke Hirano, Fumio Nakamura, Yoji Ueda, Kenzo Fujimoto
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Publication number: 20150322483Abstract: Disclosed is a method for detecting a nucleic acid using a substance that suppresses, in the labeling step of the post-staining method, detachment of a target nucleic acid that has once hybridized with a capture probe immobilized on a support, which method enables detection of the target nucleic acid with a sensitivity equivalent to or higher than that achieved by a method using sodium ion even in cases where the substance is used at a lower concentration. The method for detecting a nucleic acid comprises the steps of: (1) hybridizing a capture probe with a target nucleic acid to form a double-stranded nucleic acid; bringing the formed double-stranded nucleic acid into contact with a solution containing a labeling substance and a divalent metal cation at a concentration of not less than 10 mM to introduce the labeling substance into the double-stranded nucleic acid; and detecting the labeling substance introduced into the double-stranded nucleic acid.Type: ApplicationFiled: June 19, 2013Publication date: November 12, 2015Applicant: TORAY INDUSTRIES, INC.Inventors: Fumio NAKAMURA, Yoji UEDA, Takafumi ARIKE
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Publication number: 20150240296Abstract: A method of detecting a target nucleic acid by sandwich hybridization using a detection probe that hybridizes with the target nucleic acid, and a capture probe immobilized on a support wherein at least one nucleic acid base in the nucleic acid molecule(s) of the detection probe and/or capture probe with a photoreactive group includes irradiating, with light, a complex formed by hybridization between the target nucleic acid and the detection probe and/or capture probe to allow formation of a covalent bond(s) between the photoreactive group(s) and a nucleic acid base(s) in the target nucleic acid.Type: ApplicationFiled: August 29, 2013Publication date: August 27, 2015Inventors: Taisuke Hirano, Fumio Nakamura, Yoji Ueda, Kenzo Fujimoto
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Publication number: 20150045249Abstract: A method detects nucleic acid with high sensitivity even when the target nucleic acid is detected by sandwich hybridization using neither nucleic acid amplification nor a sensitization technique. The method includes sequentially or simultaneously bringing a target nucleic acid or fragmentation product thereof, a plurality of detection probes, and a capture probe immobilized on a support, into contact with each other to hybridize the capture probe with the target nucleic acid or fragmentation product thereof and to hybridize the target nucleic acid or fragmentation product thereof with the plurality of detection probes, thereby binding the plurality of detection probes to the support through the capture probe and the target nucleic acid or fragmentation product thereof; and then detecting the plurality of detection probes bound to the support.Type: ApplicationFiled: February 27, 2013Publication date: February 12, 2015Inventors: Yoji Ueda, Fumio Nakamura
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Patent number: 8867228Abstract: An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.Type: GrantFiled: April 30, 2012Date of Patent: October 21, 2014Assignee: Panasonic CorporationInventors: Hiroaki Katsura, Koso Matsuno, Yoji Ueda
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Publication number: 20120285731Abstract: An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.Type: ApplicationFiled: April 30, 2012Publication date: November 15, 2012Applicant: Panasonic CorporationInventors: Hiroaki KATSURA, Koso Matsuno, Yoji Ueda
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Publication number: 20090032285Abstract: A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.Type: ApplicationFiled: January 27, 2005Publication date: February 5, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Yoji Ueda, Susumu Matsuoka, Rikiya Okimoto, Shozo Ochi, Satoru Tomekawa
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Patent number: 7423884Abstract: A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.Type: GrantFiled: March 14, 2005Date of Patent: September 9, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kouhei Enchi, Yoji Ueda
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Publication number: 20080185178Abstract: A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the electrical insulating base that is arranged at an outermost layer. According to a method for manufacturing a circuit board of the present invention, includes the steps of: forming a via hole in an electrical insulating base; filling the via hole with a conductive paste; laminating a metal foil or a releasing sheet on the electrical insulating base, and placing a jig for pressing above and below the lamination, followed by hot-pressing so as to apply heat and pressure thereto, so as to form a conductive portion made of the conductive paste in the via hole; and forming a land for mounting only on at least one surface of the electrical insulating base that is arranged at an outermost layer.Type: ApplicationFiled: January 29, 2008Publication date: August 7, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Rikiya Okimoto, Yoji Ueda, Satoru Tomekawa, Tousaku Nishiyama, Shozo Ochi