Patents by Inventor Yoji Wakayama

Yoji Wakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive sheet
    Patent number: 9878520
    Abstract: An adhesive sheet having a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and which has an anti-static performance, is described. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive. In the formula, R1 is a (meth)acryloyl group; R2 is a C1-4 alkylene group; and n is an integer of from 1 to 20, such as 4 to 16.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: January 30, 2018
    Inventors: Hitoshi Ohashi, Yoji Wakayama, Kazuhiro Takahashi
  • Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
    Patent number: 9296925
    Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: March 29, 2016
    Assignee: LINTEC Corporation
    Inventors: Yoji Wakayama, Isao Ichikawa, Takashi Akutsu
  • Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and Method for Producing Semiconductor Device
    Publication number: 20150225613
    Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.
    Type: Application
    Filed: August 2, 2013
    Publication date: August 13, 2015
    Inventors: Yoji Wakayama, Isao Ichikawa, Takashi Akutsu
  • Resin film forming sheet for chip, and method for manufacturing semiconductor chip
    Patent number: 8735881
    Abstract: A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: May 27, 2014
    Assignee: LINTEC Corporation
    Inventors: Tomonori Shinoda, Yoji Wakayama
  • RESIN FILM FORMING SHEET FOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
    Publication number: 20140141570
    Abstract: A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.
    Type: Application
    Filed: January 24, 2014
    Publication date: May 22, 2014
    Applicant: LINTEC Corporation
    Inventors: Tomonori Shinoda, Yoji Wakayama
  • Resin film forming sheet for chip, and method for manufacturing semiconductor chip
    Patent number: 8674349
    Abstract: A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: March 18, 2014
    Assignee: Lintec Corporation
    Inventors: Tomonori Shinoda, Yoji Wakayama
  • Resin Film Forming Sheet for Chip, and Method for Manufacturing Semiconductor Chip
    Publication number: 20130011998
    Abstract: A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.
    Type: Application
    Filed: March 30, 2011
    Publication date: January 10, 2013
    Applicant: LINTEC CORPORATION
    Inventors: Tomonori Shinoda, Yoji Wakayama
  • Laser dicing sheet and manufacturing method for chip body
    Patent number: 8174130
    Abstract: Disclosed herein is a laser dicing sheet comprising a base material comprising a polyurethane acrylate film and a shape-restoring film; and an adhesive layer formed on a surface of said polyurethane acrylate film of the base material.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: May 8, 2012
    Assignee: Lintec Corporation
    Inventors: Yosuke Sato, Yoji Wakayama, Naoki Taya
  • Laser dicing sheet and process for producing chip body
    Patent number: 8114520
    Abstract: An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: February 14, 2012
    Assignee: LINTEC Corporation
    Inventors: Yoji Wakayama, Yosuke Sato, Naoki Taya
  • Adhesive Sheet
    Publication number: 20110045290
    Abstract: An adhesive sheet includes a substrate and an energy ray curable adhesive layer formed thereon The energy ray curable adhesive layer includes an acrylic adhesive polymer having a weight average molecular weight of not less than 100,000, and a polymerizable group is bonded to the acrylic adhesive polymer through a polyalkyleneoxy group. The energy ray curable adhesive sheet improves the breaking elongation and the expandability of the cured adhesives, thereby preventing the glue residue on the adherend of the sheet after release.
    Type: Application
    Filed: March 2, 2009
    Publication date: February 24, 2011
    Applicant: LINTEC CORPORATION
    Inventors: Jun Maeda, Keiko Tanaka, Yoji Wakayama
  • Laser Dicing Sheet and Manufacturing Method For Chip Body
    Publication number: 20090261084
    Abstract: An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.
    Type: Application
    Filed: October 11, 2007
    Publication date: October 22, 2009
    Applicant: LINTEC CORPORATION
    Inventors: Yoji Wakayama, Yosuke Sato, Naoki Taya
  • Adhesive Sheet
    Publication number: 20080220253
    Abstract: An adhesive sheet has a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and has an anti-static performance. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive. In the formula, R1 is a (meth)acryloyl group; R2 is a C1-4 alkylene group; and n is an integer of from 1 to 20.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 11, 2008
    Applicant: LINTEC CORPORATION
    Inventors: Hitoshi Ohashi, Yoji Wakayama, Kazuhiro Takahashi
  • LASER DICING SHEET AND PROCESS FOR PRODUCING CHIP BODY
    Publication number: 20080190904
    Abstract: An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.
    Type: Application
    Filed: December 3, 2007
    Publication date: August 14, 2008
    Applicant: LINTEC CORPORATION
    Inventors: Yoji WAKAYAMA, Yosuke SATO, Naoki TAYA
  • LASER DICING SHEET AND MANUFACTURING METHOD FOR CHIP BODY
    Publication number: 20080132034
    Abstract: Disclosed herein is a laser dicing sheet comprising a base material comprising a polyurethane acrylate film and a shape-restoring film; and an adhesive layer formed on a surface of said polyurethane acrylate film of the base material.
    Type: Application
    Filed: December 3, 2007
    Publication date: June 5, 2008
    Applicant: LINTEC CORPORATION
    Inventors: Yosuke SATO, Yoji WAKAYAMA, Naoki TAYA