Patents by Inventor Yoji Yamaoka

Yoji Yamaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for cooling a circuit component
    Patent number: 6442026
    Abstract: An apparatus for cooling circuit components includes a heat sink and circuit components mounted on a base. The heat sink includes a heat receiving portion for receiving heat from the circuit components. The heat sink includes a heat-transfer member provided between the heat sink and the circuit component. A spacer is provided between the circuit components and the heat sink to support the heat sink.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: August 27, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yoji Yamaoka
  • Cooling unit for cooling circuit component generating heat and electronic apparatus comprising the cooling unit
    Publication number: 20010004313
    Abstract: A cooling unit comprises a heat sink overlapped on a semiconductor package. The semiconductor package has an IC chip mounted on a circuit board. The heat sink has a heat receiving portion for receiving heat of the IC chip. A flexible heat-transfer member such as grease and a heat-transfer sheet is provided between the heat receiving portion and the IC chip. The heat sink is pushed toward the IC chip via a fixing spring and thereby the heat receiving portion and the IC chip are thermally connected while sandwiching the heat-transfer member therebetween. A spacer is provided between the circuit board and the heat sink. The spacer supports the heat sink, at a position remote from the IC chip.
    Type: Application
    Filed: December 11, 2000
    Publication date: June 21, 2001
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Yoji Yamaoka