Patents by Inventor Yoke Chin Goh

Yoke Chin Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of packaging a semiconductor device with a clip
    Patent number: 8637977
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: January 28, 2014
    Assignee: Infineon Technologies AG
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE WITH A CLIP
    Publication number: 20130285249
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Application
    Filed: June 27, 2013
    Publication date: October 31, 2013
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Semiconductor device and method of packaging a semiconductor device with a clip
    Patent number: 8486757
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: July 16, 2013
    Assignee: Infineon Technologies AG
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Electronic component and method for its production
    Patent number: 8049311
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Ting Hng
  • SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING A SEMICONDUCTOR DEVICE WITH A CLIP
    Publication number: 20110121461
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Application
    Filed: November 25, 2009
    Publication date: May 26, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Electronic Component and Method for its Production
    Publication number: 20090250807
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Application
    Filed: May 4, 2009
    Publication date: October 8, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Tin Hng