Abstract: Methods and apparatus for packaging and shipping wine. A shipping container includes: a vacuum molded base component having a plurality of cylindrical concave columns within which respective bottles are received; a substantially planar corrugated separator sheet having a plurality of receptors aligned with the axes of the columns and configured to slidably receive respective bottle necks associated with the bottles; a vacuum molded cap component for receiving the bottle necks therewithin; and an outer corrugated box within which the bottles, base component, separator, cap component components are securely disposed.

Abstract: Methods and apparatus for packaging and shipping wine. A shipping container includes: a vacuum molded base component having a plurality of cylindrical concave columns within which respective bottles are received; a substantially planar corrugated separator sheet having a plurality of receptors aligned with the axes of the columns and configured to slidably receive respective bottle necks associated with the bottles; a vacuum molded cap component for receiving the bottle necks therewithin; and an outer corrugated box within which the bottles, base component, separator, cap component components are securely disposed.

Abstract: An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.

Abstract: An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.