Patents by Inventor Yoke Meng Tan

Yoke Meng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of forming ultra high density embedded semiconductor die package
    Patent number: 12148677
    Abstract: A semiconductor device has a plurality of semiconductor die. A first prefabricated insulating film is disposed over the semiconductor die. A conductive layer is formed over the first prefabricated insulating film. An interconnect structure is formed over the semiconductor die and first prefabricated insulating film. The first prefabricated insulating film is laminated over the semiconductor die. The first prefabricated insulating film includes glass cloth, glass fiber, or glass fillers. The semiconductor die is embedded within the first prefabricated insulating film with the first prefabricated insulating film covering first and side surfaces of the semiconductor die. The interconnect structure is formed over a second surface of the semiconductor die opposite the first surface. A portion of the first prefabricated insulating film is removed after disposing the first prefabricated insulating film over the semiconductor die.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: November 19, 2024
    Assignee: JCET Semiconductor (Shaoxing) Co., Ltd.
    Inventors: See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Ching Meng Fang, Yoke Hor Phua, Bartholomew Liao
  • Embossments for thin film articles
    Patent number: 11969036
    Abstract: An embossment (100) on a sheet of film and a glove produced from the embossed sheet of film is disclosed. The embossment (100) comprises a base surface (103); a raised surface (102) opposite to the base surface (103); and at least one recessed area (104) formed therein and extending from the base surface (103) and the raised surface (102) to the base surface (103), wherein depth (Dr) of the recessed area (104) is between 50% to 99% relative to height (He) of the embossment (100) between the base surface (103) and the raised surface (102).
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: April 30, 2024
    Assignee: TOP GLOVE INTERNATIONAL SDN. BHD.
    Inventors: Chong Ban Wong, Kon Fah Hue, Ah Chye Ong, Tong Aun Ng, Yoke Meng Tan, Shi Tian Lim
  • EMBOSSMENTS FOR THIN FILM ARTICLES
    Publication number: 20210345715
    Abstract: An embossment (100) on a sheet of film and a glove produced from the embossed sheet of film is disclosed. The embossment (100) comprises a base surface (103); a raised surface (102) opposite to the base surface (103); and at least one recessed area (104) formed therein and extending from the base surface (103) and the raised surface (102) to the base surface (103), wherein depth (Dr) of the recessed area (104) is between 50% to 99% relative to height (He) of the embossment (100) between the base surface (103) and the raised surface (102).
    Type: Application
    Filed: September 21, 2020
    Publication date: November 11, 2021
    Inventors: Chong Ban Wong, Kon Fah Hue, Ah Chye Ong, Tong Aun Ng, Yoke Meng Tan, Shi Tian Lim
  • A METHOD OF EMBOSSING GLOVE FILM AND A GLOVE FILM PRODUCED THEREFROM
    Publication number: 20210197441
    Abstract: The present invention relates to a method of embossing a glove film comprising the step of passing the glove film between a pair of rollers which are a metal roller and a rubber roller, such that the film has an overlapping texture derived from the metal roller and the rubber roller, wherein the metal roller has a textured surface and the rubber roller has a rough surface.
    Type: Application
    Filed: October 31, 2017
    Publication date: July 1, 2021
    Applicant: Top Glove International Sdn Bhd
    Inventors: Kon Fah Hue, Ah Chye Ong, Tong Aun Ng, Yoke Meng Tan, Elaine Nyuk Tzi Chong