Patents by Inventor Yokesh SUBRAMANIAN

Yokesh SUBRAMANIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
    Publication number: 20180220524
    Abstract: A method for propagating a signal from an output driver on a PCB to a number of chips on the PCB. The signal is propagated from a first transmission line connected to the output driver, to a second transmission line connected to the first transmission line and a first chip, and to a third transmission line connected to the first transmission line and a second chip. The second transmission line has a length greater than or equal to 10 times the length of the first transmission line, and the third transmission line has a length greater than or equal to 10 times the length of the first transmission line. The lengths of the first transmission line, the second transmission line, and the third transmission line cause a reduction in reflections of the signal due to a change in impedance at a junction of the first, second, and third transmission lines.
    Type: Application
    Filed: March 29, 2018
    Publication date: August 2, 2018
    Inventor: Yokesh SUBRAMANIAN
  • High speed signal routing topology for better signal quality
    Patent number: 10039183
    Abstract: A method for propagating a signal from an output driver on a PCB to a number of chips on the PCB. The signal is propagated from a first transmission line connected to the output driver, to a second transmission line connected to the first transmission line and a first chip, and to a third transmission line connected to the first transmission line and a second chip. The second transmission line has a length greater than or equal to 10 times the length of the first transmission line, and the third transmission line has a length greater than or equal to 10 times the length of the first transmission line. The lengths of the first transmission line, the second transmission line, and the third transmission line cause a reduction in reflections of the signal due to a change in impedance at a junction of the first, second, and third transmission lines.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 31, 2018
    Assignee: QUALCOMM Incorporated
    Inventor: Yokesh Subramanian
  • High speed signal routing topology for better signal quality
    Patent number: 9980366
    Abstract: An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: May 22, 2018
    Assignee: QUALCOMM Incorporated
    Inventor: Yokesh Subramanian
  • NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
    Publication number: 20160205767
    Abstract: An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.
    Type: Application
    Filed: January 12, 2015
    Publication date: July 14, 2016
    Inventor: Yokesh SUBRAMANIAN