Patents by Inventor Yokichi J. Tanaka

Yokichi J. Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8163527
    Abstract: Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: April 24, 2012
    Assignee: Tecella LLC
    Inventor: Yokichi J. Tanaka
  • Patent number: 8163147
    Abstract: Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: April 24, 2012
    Assignee: Tecella LLC
    Inventor: Yokichi J. Tanaka
  • Publication number: 20110312222
    Abstract: Various embodiments of a multi-electrode holder are described. In one embodiment, the multi-electrode holder is employed to electrically connect a plurality of replaceable electrodes to a cable. In this embodiment, the multi-electrode holder includes a substrate, a plurality of independently actuatable contacts, and a connector, for connection to a cable, in electrical communication with the plurality of contacts. A plurality of channels may be formed in the substrate to receive at least two electrodes. In such a case, each contact may be aligned with a channel to retain an electrode disposed therein and to make electrical contact with such electrode. Alternatively, a plurality of electrode through-holes, for receiving electrodes, may be formed through the substrate. In this case, one end of a given electrode is retained by a contact and makes electrical contact therewith, while the other end of the electrode extends through an electrode through-hole.
    Type: Application
    Filed: June 16, 2011
    Publication date: December 22, 2011
    Inventor: Yokichi J. Tanaka
  • Patent number: 7741829
    Abstract: Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: June 22, 2010
    Assignee: Tecella, LLC
    Inventor: Yokichi J. Tanaka
  • Publication number: 20090085584
    Abstract: Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
    Type: Application
    Filed: December 4, 2008
    Publication date: April 2, 2009
    Applicant: Tecella, LLC
    Inventor: Yokichi J. Tanaka
  • Publication number: 20090078589
    Abstract: Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
    Type: Application
    Filed: December 4, 2008
    Publication date: March 26, 2009
    Applicant: Tecella, LLC
    Inventor: Yokichi J. Tanaka
  • Publication number: 20080296175
    Abstract: Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
    Type: Application
    Filed: May 2, 2008
    Publication date: December 4, 2008
    Inventor: Yokichi J. Tanaka
  • Patent number: D675171
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: January 29, 2013
    Assignee: Tecella LLC
    Inventor: Yokichi J. Tanaka