Patents by Inventor Yokihiro Takikawa

Yokihiro Takikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring boards
    Patent number: 6777622
    Abstract: In a flexible wiring board of the present invention, a first shield film is connected to a ground wiring at the bottom of an opening in a cover film. The first shield film is connected to a second shield film via a through-hole penetrating from the surface to the rear surface of a base film. Thus, the second shield film is connected to the ground wiring via the first shield film, whereby the wiring board can be wholly shielded.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: August 17, 2004
    Assignee: Sony Chemicals, Corp.
    Inventors: Yoshifumi Ueno, Yokihiro Takikawa