Patents by Inventor Yoko Irie

Yoko Irie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6072899
    Abstract: A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short
    Type: Grant
    Filed: January 23, 1998
    Date of Patent: June 6, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Yoko Irie, Hideaki Doi, Hiroya Koshishiba, Mineo Nomoto
  • Patent number: 5930382
    Abstract: A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.
    Type: Grant
    Filed: May 13, 1996
    Date of Patent: July 27, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Yoko Irie, Hideaki Doi, Yasuhiko Hara, Tadashi Iida, Yasuhiro Fujishita, Yasuo Nakagawa, Takanori Ninomiya